TY - GEN
T1 - Instability and failure analysis of film-substrate structure under electrical loading
AU - Wang, Qinghua
AU - Xie, Huimin
AU - Liu, Jia
AU - Feng, Xue
AU - Dai, Fulong
PY - 2009
Y1 - 2009
N2 - Delamination between the film line and the substrate is a main influence factor for instability and failure of the film-substrate structure, which exists widely in the large scale integrated circuit. The Buckle-driven delamination of constantan film line on polymer substrate under electrical loading was investigated in this paper. The post-buckling theory for beam was introduced to quantitatively analyze the residual strain and the residual stress. The maximal tensile stress and the maximal compressive stress of the buckled film line was found to be 1.69GPa and 2.03GPa respectively, after bearing 3.14×10 8A/m2 dc for 370.7 hours. The maximal compressive axial stress was 0.17GPa, showing the bending stress contributes to the majority of the residual stress of the film line. The instability and the failure behavior of the film-substrate structure were studied.
AB - Delamination between the film line and the substrate is a main influence factor for instability and failure of the film-substrate structure, which exists widely in the large scale integrated circuit. The Buckle-driven delamination of constantan film line on polymer substrate under electrical loading was investigated in this paper. The post-buckling theory for beam was introduced to quantitatively analyze the residual strain and the residual stress. The maximal tensile stress and the maximal compressive stress of the buckled film line was found to be 1.69GPa and 2.03GPa respectively, after bearing 3.14×10 8A/m2 dc for 370.7 hours. The maximal compressive axial stress was 0.17GPa, showing the bending stress contributes to the majority of the residual stress of the film line. The instability and the failure behavior of the film-substrate structure were studied.
UR - https://www.scopus.com/pages/publications/70449941884
U2 - 10.1109/ICEPT.2009.5270578
DO - 10.1109/ICEPT.2009.5270578
M3 - 会议稿件
AN - SCOPUS:70449941884
SN - 9781424446599
T3 - 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
SP - 1027
EP - 1029
BT - 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
T2 - 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Y2 - 10 August 2009 through 13 August 2009
ER -