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Influence of working distance on microscale strain measurement under laser scanning microscope from moiré fringes

  • Qinghua Wang
  • , Yosuke Takashita
  • , Shien Ri
  • , Hiroshi Tsuda
  • , Ryuta Kitamura
  • , Shinji Ogihara

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

In this study, the influence of the working distance (WD) on strain measurement under a laser scanning microscope and a way to achieve precise focus were investigated by the scanning moiré method. Experimental results showed that the strain measurement has a good repeatability at a fixed WD. Scanning moiré fringes were clearly observable when the WD variation range was within 0.9% of the given WD of the used objective lens. The relationship of the measured strain error and the WD difference was approximately linear, and the greatest strain error was near 700 μÎμ . Fortunately, 2D moiré fringes were distinct only in a very narrow range, i.e., the WD difference was less than 0.1% of the given WD, and the greatest strain error was less than 100 μÎμ . 1D moiré fringes in the y direction, 2D moiré fringes in the both x and y directions, and 1D moiré fringes in the x direction became distinct alternately along with the WD change. Consequently, we suggest to use 2D moiré fringes for microscale strain measurement in each focusing process to reduce the errors caused by the WD variation. Moreover, a single-shot 2D moiré image is useful to measure the strain distributions in both two directions quickly and simply, and there is no need to rotate the sample or scanning lines and scan twice as in the conventional way.

源语言英语
主期刊名International Conference on Optical and Photonics Engineering, icOPEN 2016
编辑Anand Krishna Asundi
出版商SPIE
ISBN(电子版)9781510610019
DOI
出版状态已出版 - 2017
已对外发布
活动International Conference on Optical and Photonics Engineering, icOPEN 2016 - Chengdu, 中国
期限: 26 9月 201630 9月 2016

出版系列

姓名Proceedings of SPIE - The International Society for Optical Engineering
10250
ISSN(印刷版)0277-786X
ISSN(电子版)1996-756X

会议

会议International Conference on Optical and Photonics Engineering, icOPEN 2016
国家/地区中国
Chengdu
时期26/09/1630/09/16

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