Fundamentals of die-level assembly techniques for phase-only liquid crystal on silicon devices

This paper describes fundamentals of die-level assembly techniques for phase-only liquid crystal on silicon (LCOS) devices, which have not been in-depth discussed previously. The discussion contains the introduction to the basic assembly process, analysis to key assembly procedures, inspection to the assembled device and overall quality control including pre-assembly inspection and cleaning process for both glass and silicon backplane, alignment layer deposition with baking process, glue line processing, assembly and liquid crystal filling process. In particular, glue line writing, liquid crystal filling and overall quality assessment of assembly process have been substantially investigated. Finally, the excellent quality of assembled phase-only LCOS devices with characteristics have been defined.