Failure mechanism analysis of multilayer chip inductors

The common failure modes and failure mechanisms of multilayer chip inductors were studied and a detailed study on the open-circuit failure mechanism, the short-circuit failure mechanism and the mechanism of poor tinning was made in this paper. Then some prevention and improvement measures were given. At last, combined with the pulse current test, the temperature shock test, the resistance to soldering heat and the resistance to dissolution of metallization test, the experiments results indicated that the relevant failure mechanisms were correct.