@inproceedings{787068ea65a1435e8c87761d060ce3a3,
title = "Failure analysis for electromagnetic relay contacts adhesion by using XES",
abstract = "Failure analysis is a vital tool used in the development of new products and for the improvement of existing products. And electromagnetic relay is indispensable and widely used in automatic electrical system, which has complex special structure and every component might fail. The failure analysis for electromagnetic relay have a series of methods applying for a number of failure models. The different failure models and failure mechanism of electromagnetic relay have been listed. Then a failure analysis process is proposed for the most common one, contacts adhesion. X-ray emission spectroscopy test is an important step in this process. It can help to observe more detail about morphology. After theoretical analysis, an actual case of failure analysis for electromagnetic relay contacts adhesion by using XES is presented, showing the feasibility and validity of the process. The failure mechanism is also analyzed. At last, some suggestions for improving reliability and avoiding contacts adhesion are given.",
keywords = "XES, contacts, electromagnetic relay, failure analysis",
author = "Cheng Gao and Chengcheng Fu and Jiaoying Huang and Sicong Hu",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 Prognostics and System Health Management Conference, PHM 2014 ; Conference date: 24-08-2014 Through 27-08-2014",
year = "2014",
month = dec,
day = "16",
doi = "10.1109/PHM.2014.6988141",
language = "英语",
series = "Proceedings of 2014 Prognostics and System Health Management Conference, PHM 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "97--101",
booktitle = "Proceedings of 2014 Prognostics and System Health Management Conference, PHM 2014",
address = "美国",
}