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Fabrication and characterization of tunneling current of anodic bonded dry-etched MEMS tunneling accelerometer

  • Haifeng Dong*
  • , Yilong Hao
  • , Yubin Jia
  • , Guizhen Yan
  • , Ying Wang
  • , Ting Li
  • *此作品的通讯作者
  • Peking University

科研成果: 期刊稿件文章同行评审

摘要

A tunneling accelerometer is fabricated and characterized based on the extension of the silicon-glass anodic-bonding and deep etching releasing process provided by Peking University. The tunneling current under open loop operation is tested in the air by HP4145B semiconductor analyzer, which verifies the presence of tunneling current and the exponential relationship between tunneling gap and tunneling current. The tunneling barrier is extrapolated to be from 1.182 to 2.177 eV. The threshold voltages are tested to be 14-16 V for most of the devices. The threshold voltages under -1, 0, and +1 g are tested, respectively, which shows the sensitivity of the accelerometer is about 87 mV/g.

源语言英语
页(从-至)1606-1611
页数6
期刊Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors
25
12
出版状态已出版 - 12月 2004
已对外发布

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