摘要
The microchannel heat sink provides an efficient method to solve thermal control problems of the aviation electronic components. The experiment of single-phase flow and forced convective heat transfer was carried out with FC-72 which was a good prospective electronic cooling fluid. Four rectangular microchannel heat sinks were used which has different structural parameters. The influences of liquid velocity, supercooling temperature and microchannel structures were analyzed. The correlations of single-phase flow resistance and forced convective heat transfer were given, and the uncertainty for experimental data was evaluated. The results show that the single-phase forced convective heat transfer characteristic of FC-72, flowing in rectangular microchannel heat sinks, can satisfy the heat dissipation requirements of middle or high flux for electronic devices.
| 源语言 | 英语 |
|---|---|
| 页(从-至) | 739-743 |
| 页数 | 5 |
| 期刊 | Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics |
| 卷 | 30 |
| 期 | 8 |
| 出版状态 | 已出版 - 8月 2004 |
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