@inproceedings{12f915bcc6794d37ae2888a0c543f809,
title = "Experimental and finite elemental investigations on residual stress of TSV",
abstract = "In this paper, a Micro-Infrared Photo-elasticity (MIPE) system was set up and applied to evaluate the residual stress of Si chip around TSV. The MIPE system can only give overall stress information along thickness. To investigate the stress distribution around TSV quantitatively, finite element method was employed and the simulation results were compared with that of experimental measurements. Through this investigation, the maximum principal stress and affected area around TSV were determined.",
keywords = "Finite element method, Photo-elasticity, Stress, Through Silicon Via (TSV)",
author = "Fei Su and Tianbao Lan and Yunhui Zhu and Jing Chen",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 ; Conference date: 12-08-2014 Through 15-08-2014",
year = "2014",
month = oct,
day = "13",
doi = "10.1109/ICEPT.2014.6922843",
language = "英语",
series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1133--1137",
editor = "Keyun Bi and Zhong Tian and Ziqiang Xu",
booktitle = "2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014",
address = "美国",
}