TY - GEN
T1 - Experimental and FEM study of hygro-thermo reliability of FCPBGA
AU - Li, Weijia
AU - Gong, Yonghui
AU - Su, Fei
PY - 2012
Y1 - 2012
N2 - In this paper, hygro-thermal deformations of a flip-chip-plastic-ball-grid- array (FCPBGA) package are tested using a 3-D optical testing system. It is found that the warpage of the FCPBGA package can even be reversed by moisture absorption of plastic materials. To investigate the thermal stress field of the FCPBGA and its change due to moisture absorption, finite element method (FEM) was employed, the experimental results are used to verify and modify the FEM models. With the FEM simulation,it is verified that the residual stress field of the FCPBGA can be changed greatly by moisture absorption, especially, a high peel stress occurred to the solder balls, which can be used to illustrate the failure mode of UBM opening. Through the simulation and investigation, a usually neglected reliability problem due to moisture absorption is revealed.
AB - In this paper, hygro-thermal deformations of a flip-chip-plastic-ball-grid- array (FCPBGA) package are tested using a 3-D optical testing system. It is found that the warpage of the FCPBGA package can even be reversed by moisture absorption of plastic materials. To investigate the thermal stress field of the FCPBGA and its change due to moisture absorption, finite element method (FEM) was employed, the experimental results are used to verify and modify the FEM models. With the FEM simulation,it is verified that the residual stress field of the FCPBGA can be changed greatly by moisture absorption, especially, a high peel stress occurred to the solder balls, which can be used to illustrate the failure mode of UBM opening. Through the simulation and investigation, a usually neglected reliability problem due to moisture absorption is revealed.
UR - https://www.scopus.com/pages/publications/84875480497
U2 - 10.1109/ICEPT-HDP.2012.6474803
DO - 10.1109/ICEPT-HDP.2012.6474803
M3 - 会议稿件
AN - SCOPUS:84875480497
SN - 9781467316804
T3 - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
SP - 1114
EP - 1119
BT - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
Y2 - 13 August 2012 through 16 August 2012
ER -