@inproceedings{b3f31183bd4a4c9e99bfcd2911feea17,
title = "Evolution Mechanism of Copper Grains in Advanced Interconnect Processes",
abstract = "In dual-damascene interconnect applications, the decreasing copper concentration and lower current/voltage in electrochemical plating pose challenges to Cu grain evolution. This paper investigates Cu grain growth in low-Cu plating solutions using two types of seed layers. Results show that larger original grains in CuMn seed layers lead to separation from the electroplated layer. During self-annealing, grains evolve vertically from the bottom upward due to seed stress, and horizontally from the wafer center outward under grain boundary forces. Moreover, precise control of current density can effectively optimize the growth behavior of Cu grains, thereby improving device performance.",
author = "Yinuo Jin and Han Zhang and Changqing Zhu and Liang Du and Simian Zhang and Linbo Liu and Qixing Yu and Yu Yao and Rong Yu and Chen Wang",
note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 2025 Conference of Science and Technology of Integrated Circuits, CSTIC 2025 ; Conference date: 24-05-2025 Through 25-05-2025",
year = "2025",
doi = "10.1109/CSTIC64481.2025.11017793",
language = "英语",
series = "2025 Conference of Science and Technology of Integrated Circuits, CSTIC 2025",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Cor Claeys and Beichao Zhang and Beichao Zhang and Bin Yu and Peng Bai and Qianqian Huang and Xiaowei Li and Liang, \{Steve X.\} and Hsiang-Lan Lung and Linyong Pang and Weikang Qian and Xinping Qu and Xiaoping Shi and Jianshi Tang and Ying Zhang and Pingqiang Zhou and Cheng Zhuo",
booktitle = "2025 Conference of Science and Technology of Integrated Circuits, CSTIC 2025",
address = "美国",
}