TY - JOUR
T1 - Electromagnetic susceptibility analysis method for 3D TSV ICs
AU - Qin, Haichao
AU - Yan, Zhaowen
AU - Su, Donglin
AU - Zhang, Wei
N1 - Publisher Copyright:
© 2017, Editorial Board of JBUAA. All right reserved.
PY - 2017/12/1
Y1 - 2017/12/1
N2 - This paper focuses on the circuit modeling method of through silicon via (TSV) and power distribution network (PDN) in 3D integrated circuits (3D ICs). Combined with the PDN on printed circuit board (PCB) and the chip PDN model, an electromagnetic susceptibility (EMS) modeling and collaborative analysis method for 3D ICs on PCB was proposed. Firstly, a ground-signal (GS) TSV pair and two TSV pairs of ground-signal1-signal2-ground (GSSG) were established in, and these circuit models were compared with the numerical simulation results, which validated the accuracy of the circuit modeling method of TSV. Then, the modeling method of PDN of PCB, PCB through via hole, IC's package parameters in an IC were discussed. Finally, an EMS cascade connection analysis model from PCB to 3D ICs was developed and used to analyze the electromagnetic susceptibility characteristics of 3D ICs to power interference, which can guide the susceptibility analysis of 3D ICs.
AB - This paper focuses on the circuit modeling method of through silicon via (TSV) and power distribution network (PDN) in 3D integrated circuits (3D ICs). Combined with the PDN on printed circuit board (PCB) and the chip PDN model, an electromagnetic susceptibility (EMS) modeling and collaborative analysis method for 3D ICs on PCB was proposed. Firstly, a ground-signal (GS) TSV pair and two TSV pairs of ground-signal1-signal2-ground (GSSG) were established in, and these circuit models were compared with the numerical simulation results, which validated the accuracy of the circuit modeling method of TSV. Then, the modeling method of PDN of PCB, PCB through via hole, IC's package parameters in an IC were discussed. Finally, an EMS cascade connection analysis model from PCB to 3D ICs was developed and used to analyze the electromagnetic susceptibility characteristics of 3D ICs to power interference, which can guide the susceptibility analysis of 3D ICs.
KW - Circuit model of TSV
KW - Electromagnetic susceptibility (EMS)
KW - Power distribution network (PDN)
KW - Printed circuit board (PCB)
KW - Through silicon via (TSV)
UR - https://www.scopus.com/pages/publications/85040375071
U2 - 10.13700/j.bh.1001-5965.2016.0847
DO - 10.13700/j.bh.1001-5965.2016.0847
M3 - 文章
AN - SCOPUS:85040375071
SN - 1001-5965
VL - 43
SP - 2406
EP - 2415
JO - Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics
JF - Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics
IS - 12
ER -