摘要
Potential problems induced by the multilayered manufacturing process pose a serious threat to the long-term reliability of MEMSCAP® actuators under in-service thermal cycling. Damage would initiate and propagate in different material layers because of a large mismatch of their thermal expansions. In this research, residual stresses and variations of design parameters induced by metal multi-user micro electromechanical system processes (MetalMUMPs) were examined to evaluate their effects on the thermal fatigue lifetime of the multilayer structure and, thus, to improve MEMSCAP® design. Since testing in such micro internal structure is difficult to conduct and traditional testing schemes are destructive, a numerical subdomain method based on a finite element technique was employed. Thermomechanical deformation from metal to insulator layers under in-service temperature cycling (obtained from the multiphysics model of the entire actuator, which was validated by experimental and specified analytical solutions) was accurately estimated to define failures with a significant efficiency and feasibility. Simulation results showed that critical failure modes included interface delamination, plastic deformation, micro cracking, and thermal fatigue, similarly to what was concluded in the MEMSCAP® technical report.
| 源语言 | 英语 |
|---|---|
| 期刊论文编号 | 348 |
| 期刊 | Micromachines |
| 卷 | 8 |
| 期 | 12 |
| DOI | |
| 出版状态 | 已出版 - 29 11月 2017 |
学术指纹
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