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Effects of laser powder bed fusion process parameters on microstructure and hydrogen embrittlement of high-entropy alloy

  • Hongxu Cheng
  • , Hong Luo*
  • , Zhimin Pan
  • , Xuefei Wang
  • , Qiancheng Zhao
  • , Yu Fu
  • , Xiaogang Li
  • *此作品的通讯作者
  • University of Science and Technology Beijing
  • Key Laboratory of Precision Opto-Mechatronics Technology (Ministry of Education)

科研成果: 期刊稿件文章同行评审

摘要

Hydrogen embrittlement behavior, micro-deformation, and crack propagation mechanism of CoCrFeNiMn high-entropy alloy (HEA) fabricated by laser powder bed fusion (LPBF) under different parameters were investigated by slow strain rate tensile tests (at room temperature) with/without electrochemical hydrogen pre-charging. The LPBF CoCrFeNiMn HEA shows excellent resistance to hydrogen embrittlement. Unsuitable LPBF parameters are accompanied by many microcracks and holes, resulting in a slight decrease in the hydrogen embrittlement resistance of the material. The electron backscatter diffraction (EBSD), electron channeling contrast image (ECCI) techniques, and transmission electron microscope (TEM) were carried out to research the main influencing factors of hydrogen on the deformation mechanism and crack propagation. Compared with un-charged samples, a larger number of deformation twins (DTs) appear in the deformation process of hydrogen-charged LPBF CoCrFeNiMn, attributing to the reduction of stacking fault energy (SFE) due to the ingress of hydrogen. The nano DTs and crossing twin system contribute to the extra work hardening, and a strain hardening platform is observed for all hydrogen-charged samples, resulting in the increase of strain hardening rate or the mitigation of the loss of strain hardening. Although unsuitable process parameters will trigger fabrication defects and reduce mechanical properties, the cellular structure can bring a hydrogen-induced strain hardening platform for LPBF CoCrFeNiMn to reduce the damage caused by hydrogen embrittlement.

源语言英语
页(从-至)211-226
页数16
期刊Journal of Materials Science and Technology
155
DOI
出版状态已出版 - 20 8月 2023
已对外发布

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