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Effect of interaction between P and Ce on properties of copper

  • Jin Tao Song
  • , Yu Duo Fu
  • , Ke Xing Song*
  • , Qian Qian Zhu
  • , Xiao Wen Peng
  • , Yun Xiao Hua
  • , Yan Jun Zhou
  • , Xiu Hua Guo
  • , Shi Zhong An
  • , Ying Xuan Ma
  • *此作品的通讯作者
  • Henan University of Science and Technology
  • Henan Key Laboratory of Nonferrous Materials Science and Processing Technology
  • Collaborative Innovation Center of Nonferrous Metals
  • Henan Academy of Sciences

科研成果: 期刊稿件文章同行评审

摘要

The effect of interaction between Ce and P on the microstructure and properties of copper has been rarely reported. In this study, it was investigated by utilising the OM, EPMA, SEM and TEM techniques, combined with conductivity and tensile tests. The results indicated that the grain size and conductivity of as-cast copper could be significantly influenced by the interaction. More importantly, the plasticity of as-cast copper did not seriously damage by the interaction, and the elongation of as-cast 3# (Cu-0.016P-0.075Ce) was still up to 39.3%. This is due to a strong binding force of the coherent interface between CeP and copper.

源语言英语
页(从-至)2966-2975
页数10
期刊Materials Science and Technology (United Kingdom)
39
18
DOI
出版状态已出版 - 2023
已对外发布

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