TY - JOUR
T1 - Effect of chloride concentration on passive film properties on copper
AU - Kong, Decheng
AU - Dong, Chaofang
AU - Zhao, Mifeng
AU - Ni, Xiaoqing
AU - Man, Cheng
AU - Li, Xiaogang
N1 - Publisher Copyright:
© 2017 Institute of Materials, Minerals and Mining Published by Taylor & Francis on behalf of the Institute.
PY - 2018/2/17
Y1 - 2018/2/17
N2 - The semiconducting properties of passive films formed on copper, in anaerobic alkaline sodium chloride solution, were studied using Mott–Schottky analysis and electrochemical impedance spectroscopy, based on the point defect model. Results showed that the corrosion resistance increased with increasing potential, which was attributed to a well crystallised, refined grain structure, and a thicker passive film at higher potential. P-type semiconducting characteristics were obtained with or without chloride. The density of copper vacancies was approximately 1020 cm−3, and increased with the increasing chloride concentration, which was attributed to faster film-formation in a higher chloride environment. The diffusion coefficient of the defects, a key dynamic parameter for passive film breakdown, was in the range of 10−16–10−15 cm2 s−1, and increased with increasing chloride concentration, thus leading to a greater probability of pitting.
AB - The semiconducting properties of passive films formed on copper, in anaerobic alkaline sodium chloride solution, were studied using Mott–Schottky analysis and electrochemical impedance spectroscopy, based on the point defect model. Results showed that the corrosion resistance increased with increasing potential, which was attributed to a well crystallised, refined grain structure, and a thicker passive film at higher potential. P-type semiconducting characteristics were obtained with or without chloride. The density of copper vacancies was approximately 1020 cm−3, and increased with the increasing chloride concentration, which was attributed to faster film-formation in a higher chloride environment. The diffusion coefficient of the defects, a key dynamic parameter for passive film breakdown, was in the range of 10−16–10−15 cm2 s−1, and increased with increasing chloride concentration, thus leading to a greater probability of pitting.
KW - Copper vacancy
KW - chloride
KW - diffusion coefficient
KW - passive film
UR - https://www.scopus.com/pages/publications/85037659849
U2 - 10.1080/1478422X.2017.1413160
DO - 10.1080/1478422X.2017.1413160
M3 - 文章
AN - SCOPUS:85037659849
SN - 1478-422X
VL - 53
SP - 122
EP - 130
JO - Corrosion Engineering Science and Technology
JF - Corrosion Engineering Science and Technology
IS - 2
ER -