跳到主要导航 跳到搜索 跳到主要内容

Dynamic simulation of solid-state diffusion bonding

  • G. Q. Wu*
  • , Z. F. Li
  • , G. X. Luo
  • , H. Y. Li
  • , Z. Huang
  • *此作品的通讯作者
  • Beihang University

科研成果: 期刊稿件文章同行评审

摘要

By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The effects of different operating mechanisms, bonding parameters and microstructures on bonding were investigated. The simulation results indicate that, it is vital to consider the real information of the intended bonding surfaces and the effect of diffusion distance in a definite time; the metastable microstructure and the stable ultrafine microstructure exhibit better bonding characteristic than that of the original stable microstructure, which is in agreement with experimental results.

源语言英语
页(从-至)529-535
页数7
期刊Materials Science and Engineering: A
452-453
DOI
出版状态已出版 - 15 4月 2007

学术指纹

探究 'Dynamic simulation of solid-state diffusion bonding' 的科研主题。它们共同构成独一无二的学术指纹。

引用此