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Digital twin system framework and information model for industry chain based on industrial Internet

  • Wenxuan Wang
  • , Yongqin Liu
  • , Xudong Chai
  • , Lin Zhang*
  • *此作品的通讯作者
  • Beihang University
  • Jilin University
  • China Aerospace Science and Industry Corporation

科研成果: 期刊稿件文章同行评审

摘要

The integration of industrial Internet, cloud computing, and big data technology is changing the business and management mode of the industry chain. However, the industry chain is characterized by a wide range of fields, complex environment, and many factors, which creates a challenge for efficient integration and leveraging of industrial big data. Aiming at the integration of physical space and virtual space of the current industry chain, we propose an industry chain digital twin (DT) system framework for the industrial Internet. In addition, an industry chain information model based on a knowledge graph (KG) is proposed to integrate complex and heterogeneous industry chain data and extract industrial knowledge. First, the ontology of the industry chain is established, and an entity alignment method based on scientific and technological achievements is proposed. Second, the bidirectional encoder representations from Transformers (BERT) based multi-head selection model is proposed for joint entity–relation extraction of industry chain information. Third, a relation completion model based on a relational graph convolutional network (R-GCN) and a graph sample and aggregate network (GraphSAGE) is proposed which considers both semantic information and graph structure information of KG. Experimental results show that the performances of the proposed joint entity–relation extraction model and relation completion model are significantly better than those of the baselines. Finally, an industry chain information model is established based on the data of 18 industry chains in the field of basic machinery, which proves the feasibility of the proposed method.

源语言英语
页(从-至)951-967
页数17
期刊Frontiers of Information Technology and Electronic Engineering
25
7
DOI
出版状态已出版 - 7月 2024

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