摘要
Digital twin (DT) provides an effective way for the cyber-physical integration towards smart manufacturing. As manufacturing enterprises seek manufacturing collaboration, the original simple system-level shop-floor problems are gradually escalating to complex system-level shop-floor problems. Complex system-oriented DT will generate more elements and precise production control, through the two-way interaction between the cyber and physical layer. As for the problem about how to realize the complex system-oriented DT, this paper specifies and highlights a construction method for complex system-oriented DT from the perspective of cyber-physical shop-floor and to investigate their operational mechanisms. Finally, a satellite AIT(Assembly, Integration and Test) shop-floor is chosen as the case to validate the feasibility of proposed framework, methods and mechanisms.
| 源语言 | 英语 |
|---|---|
| 页(从-至) | 52-57 |
| 页数 | 6 |
| 期刊 | Procedia CIRP |
| 卷 | 119 |
| DOI | |
| 出版状态 | 已出版 - 2023 |
| 活动 | 33rd CIRP Design Conference - Sydney, 澳大利亚 期限: 17 5月 2023 → 19 5月 2023 |
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