Design, manufacturing and recycling in product lifecycle: New challenges and trends

Longfei Zhou; Shengsheng Cao; Jiaxin Liu; Tian Tan; Fuxin Du; Yajun Fang; Lin Zhang

doi:10.1109/UV.2018.8709326

Design, manufacturing and recycling in product lifecycle: New challenges and trends

Longfei Zhou
, Shengsheng Cao
, Jiaxin Liu
, Tian Tan
, Fuxin Du^*
, Yajun Fang
, Lin Zhang

^*此作品的通讯作者

自动化科学与电气工程学院

Massachusetts Institute of Technology
Tsinghua University
University of Electronic Science and Technology of China
International Recycling
Shanghai Normal University

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

4 引用（Scopus）

摘要

Development of new technologies such as Internet of Things, Cloud-based Platform and Artificial Intelligence has brought new challenges and opportunities to the whole product lifecycle. Design, manufacturing and recycling are the most important stages in the product lifecycle. This paper analyzes new challenges and development trends of product lifecycle in terms of individualized design, intelligent manufacturing and new recycling. The effects of new technologies on product lifecycle management and optimization are also discussed. In product design, we discussed the relationship between requirements, design and products. In manufacturing, we analyzed challenges in manufacturing processes and new trends such as cloud manufacturing and intelligent manufacturing. In recycling, we reviewed the problems in recycling and discussed the new methods.

源语言	英语
主期刊名	4th IEEE International Conference on Universal Village 2018, UV 2018
出版商	Institute of Electrical and Electronics Engineers Inc.
ISBN（电子版）	9781538651971
DOI	https://doi.org/10.1109/UV.2018.8709326
出版状态	已出版 - 2 7月 2018
活动	4th IEEE International Conference on Universal Village, UV 2018 - Boston, 美国期限: 21 10月 2018 → 24 10月 2018

丛书

姓名	4th IEEE International Conference on Universal Village 2018, UV 2018
卷	2019-January

会议

会议	4th IEEE International Conference on Universal Village, UV 2018
国家/地区	美国
市	Boston
时期	21/10/18 → 24/10/18

联合国可持续发展目标

此成果有助于实现下列可持续发展目标：

可持续发展目标 7 经济适用的清洁能源
可持续发展目标 11 可持续城市和社区

访问文件

10.1109/UV.2018.8709326

其它文件与链接

链接到 Scopus 的出版物

引用此

Zhou, L., Cao, S., Liu, J., Tan, T., Du, F., Fang, Y., & Zhang, L. (2018). Design, manufacturing and recycling in product lifecycle: New challenges and trends. 在 4th IEEE International Conference on Universal Village 2018, UV 2018 期刊论文 8709326 (4th IEEE International Conference on Universal Village 2018, UV 2018; 卷 2019-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/UV.2018.8709326

@inproceedings{de7faf367c78498892d04106f34bdff0,

title = "Design, manufacturing and recycling in product lifecycle: New challenges and trends",

abstract = "Development of new technologies such as Internet of Things, Cloud-based Platform and Artificial Intelligence has brought new challenges and opportunities to the whole product lifecycle. Design, manufacturing and recycling are the most important stages in the product lifecycle. This paper analyzes new challenges and development trends of product lifecycle in terms of individualized design, intelligent manufacturing and new recycling. The effects of new technologies on product lifecycle management and optimization are also discussed. In product design, we discussed the relationship between requirements, design and products. In manufacturing, we analyzed challenges in manufacturing processes and new trends such as cloud manufacturing and intelligent manufacturing. In recycling, we reviewed the problems in recycling and discussed the new methods.",

keywords = "design, manufacturing, product lifecycle, recycling, review, trend",

author = "Longfei Zhou and Shengsheng Cao and Jiaxin Liu and Tian Tan and Fuxin Du and Yajun Fang and Lin Zhang",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 4th IEEE International Conference on Universal Village, UV 2018 ; Conference date: 21-10-2018 Through 24-10-2018",

year = "2018",

month = jul,

day = "2",

doi = "10.1109/UV.2018.8709326",

language = "英语",

series = "4th IEEE International Conference on Universal Village 2018, UV 2018",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "4th IEEE International Conference on Universal Village 2018, UV 2018",

address = "美国",

}

Zhou, L, Cao, S, Liu, J, Tan, T, Du, F, Fang, Y & Zhang, L 2018, Design, manufacturing and recycling in product lifecycle: New challenges and trends. 在 4th IEEE International Conference on Universal Village 2018, UV 2018., 8709326, 4th IEEE International Conference on Universal Village 2018, UV 2018, 卷 2019-January, Institute of Electrical and Electronics Engineers Inc., 4th IEEE International Conference on Universal Village, UV 2018, Boston, 美国, 21/10/18. https://doi.org/10.1109/UV.2018.8709326

Design, manufacturing and recycling in product lifecycle: New challenges and trends. / Zhou, Longfei; Cao, Shengsheng; Liu, Jiaxin 等.
4th IEEE International Conference on Universal Village 2018, UV 2018. Institute of Electrical and Electronics Engineers Inc., 2018. 8709326 (4th IEEE International Conference on Universal Village 2018, UV 2018; 卷 2019-January).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

TY - GEN

T1 - Design, manufacturing and recycling in product lifecycle

T2 - 4th IEEE International Conference on Universal Village, UV 2018

AU - Zhou, Longfei

AU - Cao, Shengsheng

AU - Liu, Jiaxin

AU - Tan, Tian

AU - Du, Fuxin

AU - Fang, Yajun

AU - Zhang, Lin

PY - 2018/7/2

Y1 - 2018/7/2

N2 - Development of new technologies such as Internet of Things, Cloud-based Platform and Artificial Intelligence has brought new challenges and opportunities to the whole product lifecycle. Design, manufacturing and recycling are the most important stages in the product lifecycle. This paper analyzes new challenges and development trends of product lifecycle in terms of individualized design, intelligent manufacturing and new recycling. The effects of new technologies on product lifecycle management and optimization are also discussed. In product design, we discussed the relationship between requirements, design and products. In manufacturing, we analyzed challenges in manufacturing processes and new trends such as cloud manufacturing and intelligent manufacturing. In recycling, we reviewed the problems in recycling and discussed the new methods.

AB - Development of new technologies such as Internet of Things, Cloud-based Platform and Artificial Intelligence has brought new challenges and opportunities to the whole product lifecycle. Design, manufacturing and recycling are the most important stages in the product lifecycle. This paper analyzes new challenges and development trends of product lifecycle in terms of individualized design, intelligent manufacturing and new recycling. The effects of new technologies on product lifecycle management and optimization are also discussed. In product design, we discussed the relationship between requirements, design and products. In manufacturing, we analyzed challenges in manufacturing processes and new trends such as cloud manufacturing and intelligent manufacturing. In recycling, we reviewed the problems in recycling and discussed the new methods.

KW - design

KW - manufacturing

KW - product lifecycle

KW - recycling

KW - review

KW - trend

UR - https://www.scopus.com/pages/publications/85065868332

U2 - 10.1109/UV.2018.8709326

DO - 10.1109/UV.2018.8709326

M3 - 会议稿件

AN - SCOPUS:85065868332

T3 - 4th IEEE International Conference on Universal Village 2018, UV 2018

BT - 4th IEEE International Conference on Universal Village 2018, UV 2018

PB - Institute of Electrical and Electronics Engineers Inc.

Y2 - 21 October 2018 through 24 October 2018

ER -

Zhou L, Cao S, Liu J, Tan T, Du F, Fang Y 等. Design, manufacturing and recycling in product lifecycle: New challenges and trends. 在 4th IEEE International Conference on Universal Village 2018, UV 2018. Institute of Electrical and Electronics Engineers Inc. 2018. 8709326. (4th IEEE International Conference on Universal Village 2018, UV 2018). doi: 10.1109/UV.2018.8709326

Design, manufacturing and recycling in product lifecycle: New challenges and trends

摘要

丛书

会议

联合国可持续发展目标

访问文件

其它文件与链接

学术指纹

引用此