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Delving into Commit-Issue Correlation to Enhance Commit Message Generation Models

  • Liran Wang
  • , Xunzhu Tang
  • , Yichen He
  • , Changyu Ren
  • , Shuhua Shi
  • , Chaoran Yan
  • , Zhoujun Li*
  • *此作品的通讯作者
  • Beihang University
  • University of Luxembourg

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Commit message generation (CMG) is a challenging task in automated software engineering that aims to generate natural language descriptions of code changes for commits. Previous methods all start from the modified code snippets, outputting commit messages through template-based, retrieval-based, or learning-based models. While these methods can summarize what is modified from the perspective of code, they struggle to provide reasons for the commit. The correlation between commits and issues that could be a critical factor for generating rational commit messages is still unexplored. In this work, we delve into the correlation between commits and issues from the perspective of dataset and methodology. We construct the first dataset anchored on combining correlated commits and issues. The dataset consists of an unlabeled commit-issue parallel part and a labeled part in which each example is provided with human-annotated rational information in the issue. Furthermore, we propose ExGroFi (Extraction, Grounding, Ene-tuning), a novel paradigm that can introduce the correlation between commits and issues into the training phase of models. To evaluate whether it is effective, we perform comprehensive experiments with various state-of-the-art CMG models. The results show that compared with the original models, the performance of ExGroFi-enhanced models is significantly improved.

源语言英语
主期刊名Proceedings - 2023 38th IEEE/ACM International Conference on Automated Software Engineering, ASE 2023
出版商Institute of Electrical and Electronics Engineers Inc.
710-722
页数13
ISBN(电子版)9798350329964
DOI
出版状态已出版 - 2023
活动38th IEEE/ACM International Conference on Automated Software Engineering, ASE 2023 - Echternach, 卢森堡
期限: 11 9月 202315 9月 2023

出版系列

姓名Proceedings - 2023 38th IEEE/ACM International Conference on Automated Software Engineering, ASE 2023

会议

会议38th IEEE/ACM International Conference on Automated Software Engineering, ASE 2023
国家/地区卢森堡
Echternach
时期11/09/2315/09/23

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