TY - GEN
T1 - D-Band Hairpin Filters Based on TGV Technology
AU - Lv, Pengyang
AU - Li, Zhaoying
AU - Liu, Kaiyue
AU - Si, Liming
AU - Sun, Houjun
AU - Wen, Lianggong
AU - Bao, Xiue
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - This paper focuses on the design of a D-band hairpin filter based on Through-Glass Via (TGV) technology. As a essential part of the millimeter-wave band, the D band (110-170 GHz) has broad application prospects in fields such as 5G, 6G communications, radar systems, and high-resolution imaging. However, the high-frequency characteristics of the D band pose higher requirements for the design of radio-frequency (RF) devices. This paper first introduces the basic structure and working principle of the hairpin filter. Then, it elaborates on the design process of a seventh-order Chebyshev band-pass hairpin filter based on TGV technology. The structural parameters of the filter are optimized through a finite-element full-wave electromagnetic simulation platform to meet the performance requirements in the D band. In addition, a novel hairpin filter structure is proposed, in which a U-shaped hairpin structure is formed by hollowing out the ground to further improve the filter's performance. The simulation results show that the designed filter has good bandwidth characteristics and insertion loss characteristics in the D band, providing a high-performance filtering solution for high-frequency communications and radar systems.
AB - This paper focuses on the design of a D-band hairpin filter based on Through-Glass Via (TGV) technology. As a essential part of the millimeter-wave band, the D band (110-170 GHz) has broad application prospects in fields such as 5G, 6G communications, radar systems, and high-resolution imaging. However, the high-frequency characteristics of the D band pose higher requirements for the design of radio-frequency (RF) devices. This paper first introduces the basic structure and working principle of the hairpin filter. Then, it elaborates on the design process of a seventh-order Chebyshev band-pass hairpin filter based on TGV technology. The structural parameters of the filter are optimized through a finite-element full-wave electromagnetic simulation platform to meet the performance requirements in the D band. In addition, a novel hairpin filter structure is proposed, in which a U-shaped hairpin structure is formed by hollowing out the ground to further improve the filter's performance. The simulation results show that the designed filter has good bandwidth characteristics and insertion loss characteristics in the D band, providing a high-performance filtering solution for high-frequency communications and radar systems.
KW - Chebyshev filter
KW - D band
KW - Hairpin filter
KW - RF device design
KW - Through Glass Via (TGV) technology
UR - https://www.scopus.com/pages/publications/105034661900
U2 - 10.1109/ICTA68203.2025.11329596
DO - 10.1109/ICTA68203.2025.11329596
M3 - 会议稿件
AN - SCOPUS:105034661900
T3 - 2025 IEEE 8th International Conference on Integrated Circuits, Technologies and Applications, ICTA 2025
SP - 192
EP - 193
BT - 2025 IEEE 8th International Conference on Integrated Circuits, Technologies and Applications, ICTA 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2025 IEEE 8th International Conference on Integrated Circuits, Technologies, and Applications, ICTA2025
Y2 - 22 October 2025 through 24 October 2025
ER -