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D-Band Hairpin Filters Based on TGV Technology

  • Beijing Institute of Technology

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

This paper focuses on the design of a D-band hairpin filter based on Through-Glass Via (TGV) technology. As a essential part of the millimeter-wave band, the D band (110-170 GHz) has broad application prospects in fields such as 5G, 6G communications, radar systems, and high-resolution imaging. However, the high-frequency characteristics of the D band pose higher requirements for the design of radio-frequency (RF) devices. This paper first introduces the basic structure and working principle of the hairpin filter. Then, it elaborates on the design process of a seventh-order Chebyshev band-pass hairpin filter based on TGV technology. The structural parameters of the filter are optimized through a finite-element full-wave electromagnetic simulation platform to meet the performance requirements in the D band. In addition, a novel hairpin filter structure is proposed, in which a U-shaped hairpin structure is formed by hollowing out the ground to further improve the filter's performance. The simulation results show that the designed filter has good bandwidth characteristics and insertion loss characteristics in the D band, providing a high-performance filtering solution for high-frequency communications and radar systems.

源语言英语
主期刊名2025 IEEE 8th International Conference on Integrated Circuits, Technologies and Applications, ICTA 2025
出版商Institute of Electrical and Electronics Engineers Inc.
192-193
页数2
ISBN(电子版)9798331571627
DOI
出版状态已出版 - 2025
活动2025 IEEE 8th International Conference on Integrated Circuits, Technologies, and Applications, ICTA2025 - Macao, 中国
期限: 22 10月 202524 10月 2025

出版系列

姓名2025 IEEE 8th International Conference on Integrated Circuits, Technologies and Applications, ICTA 2025

会议

会议2025 IEEE 8th International Conference on Integrated Circuits, Technologies, and Applications, ICTA2025
国家/地区中国
Macao
时期22/10/2524/10/25

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