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Constitutive model for SMA considering arbitrary thermal-mechanical loading and loading history

  • Collaborative Innovation Center of Advanced Aero-Engine
  • National Key Laboratory of Science and Technology on Aero Engines Aero-Thermodynamics

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Shape memory alloy (SMA) is capable of memorizing and regaining its original shape after being heated over its phase transformation temperature. Due to this so-called shape memory effect, SMAs are widely used as actuators in engineering. Over the last decade, with the development of SMA thin film technology, SMA has been used in MEMS devices like micro-grippers, micro-valves, and micro-pumps. For most applications, SMAs usually undergo arbitrary thermal and mechanical loadings, which lead to complex responses of SMAs. However, current SMA constitutive models mostly consider the response of SMA under an independent thermal or mechanical loading, only several models take proportional thermal-mechanical loading into account. Therefore, in order to further explore the application of SMA in MEMS, one great challenge is to predict the complex response of SMAs accurately under various thermal-mechanical loadings. As a result, this paper aims to develop a constitutive model capable of depicting responses of SMAs under arbitrary thermal-mechanical loading. The model is based on a former proposed SMA constitutive model, which was developed to consider cyclic degradation of SMA subjected to repeated thermal-mechanical loading. New hardening function and transformation function with non-constant parameters were proposed in the model to consider the shifting of transformation boundaries under four arbitrary loadings: In-strip fluctuation, minor loop, full transformation loop, and elastic fluctuation. Corresponding identification procedures for these non-constant parameters were also introduced. Finally, to validate the proposed model, simulations of the superelastic and shape memory behaviors of SMA under arbitrary loading paths like in-strip fluctuation, minor loop, and full transformation loop were performed. Good correlation between simulations and experiments demonstrates the ability of the model to depict both superelastic and shape memory behaviors of SMA under arbitrary loading.

源语言英语
主期刊名2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
出版商Institute of Electrical and Electronics Engineers Inc.
1-10
页数10
ISBN(电子版)9781538630426
DOI
出版状态已出版 - 2 7月 2017
活动2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017 - Singapore, 新加坡
期限: 6 12月 20179 12月 2017

出版系列

姓名2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
2018-February

会议

会议2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017
国家/地区新加坡
Singapore
时期6/12/179/12/17

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