TY - GEN
T1 - Constitutive model for SMA considering arbitrary thermal-mechanical loading and loading history
AU - Zhang, Xiaoyong
AU - Huang, Dawei
AU - Qi, Mingjing
AU - Yan, Xiaojun
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - Shape memory alloy (SMA) is capable of memorizing and regaining its original shape after being heated over its phase transformation temperature. Due to this so-called shape memory effect, SMAs are widely used as actuators in engineering. Over the last decade, with the development of SMA thin film technology, SMA has been used in MEMS devices like micro-grippers, micro-valves, and micro-pumps. For most applications, SMAs usually undergo arbitrary thermal and mechanical loadings, which lead to complex responses of SMAs. However, current SMA constitutive models mostly consider the response of SMA under an independent thermal or mechanical loading, only several models take proportional thermal-mechanical loading into account. Therefore, in order to further explore the application of SMA in MEMS, one great challenge is to predict the complex response of SMAs accurately under various thermal-mechanical loadings. As a result, this paper aims to develop a constitutive model capable of depicting responses of SMAs under arbitrary thermal-mechanical loading. The model is based on a former proposed SMA constitutive model, which was developed to consider cyclic degradation of SMA subjected to repeated thermal-mechanical loading. New hardening function and transformation function with non-constant parameters were proposed in the model to consider the shifting of transformation boundaries under four arbitrary loadings: In-strip fluctuation, minor loop, full transformation loop, and elastic fluctuation. Corresponding identification procedures for these non-constant parameters were also introduced. Finally, to validate the proposed model, simulations of the superelastic and shape memory behaviors of SMA under arbitrary loading paths like in-strip fluctuation, minor loop, and full transformation loop were performed. Good correlation between simulations and experiments demonstrates the ability of the model to depict both superelastic and shape memory behaviors of SMA under arbitrary loading.
AB - Shape memory alloy (SMA) is capable of memorizing and regaining its original shape after being heated over its phase transformation temperature. Due to this so-called shape memory effect, SMAs are widely used as actuators in engineering. Over the last decade, with the development of SMA thin film technology, SMA has been used in MEMS devices like micro-grippers, micro-valves, and micro-pumps. For most applications, SMAs usually undergo arbitrary thermal and mechanical loadings, which lead to complex responses of SMAs. However, current SMA constitutive models mostly consider the response of SMA under an independent thermal or mechanical loading, only several models take proportional thermal-mechanical loading into account. Therefore, in order to further explore the application of SMA in MEMS, one great challenge is to predict the complex response of SMAs accurately under various thermal-mechanical loadings. As a result, this paper aims to develop a constitutive model capable of depicting responses of SMAs under arbitrary thermal-mechanical loading. The model is based on a former proposed SMA constitutive model, which was developed to consider cyclic degradation of SMA subjected to repeated thermal-mechanical loading. New hardening function and transformation function with non-constant parameters were proposed in the model to consider the shifting of transformation boundaries under four arbitrary loadings: In-strip fluctuation, minor loop, full transformation loop, and elastic fluctuation. Corresponding identification procedures for these non-constant parameters were also introduced. Finally, to validate the proposed model, simulations of the superelastic and shape memory behaviors of SMA under arbitrary loading paths like in-strip fluctuation, minor loop, and full transformation loop were performed. Good correlation between simulations and experiments demonstrates the ability of the model to depict both superelastic and shape memory behaviors of SMA under arbitrary loading.
UR - https://www.scopus.com/pages/publications/85050763067
U2 - 10.1109/EPTC.2017.8277526
DO - 10.1109/EPTC.2017.8277526
M3 - 会议稿件
AN - SCOPUS:85050763067
T3 - 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
SP - 1
EP - 10
BT - 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017
Y2 - 6 December 2017 through 9 December 2017
ER -