TY - GEN
T1 - Characteristics of photo-mechanical device using PLZT wafer
AU - Liang, Lei
AU - Wang, Shaoping
AU - Cao, Feng
PY - 2006
Y1 - 2006
N2 - In order to avoid electromagnetic disturbance, photostrictive ceramics becomes promising material to realize the optic-signal transmission and photostriction. This paper studies the dynamic characteristics of PLZT, investigates its optical bend and addresses its influence factors so as to provide the theoretical base of PLZT wafer for optical drive. Whereas the stretch of PLZT is only 1μm irradiated by ultraviolet light in unilateralism, this paper adopts the bimorph and amplificatory plate to reach 100μm. The experimental results indicate that PLZT can be used to stretch the tiny displacement with light that dynamic characteristic can meet the requirement of optical drive.
AB - In order to avoid electromagnetic disturbance, photostrictive ceramics becomes promising material to realize the optic-signal transmission and photostriction. This paper studies the dynamic characteristics of PLZT, investigates its optical bend and addresses its influence factors so as to provide the theoretical base of PLZT wafer for optical drive. Whereas the stretch of PLZT is only 1μm irradiated by ultraviolet light in unilateralism, this paper adopts the bimorph and amplificatory plate to reach 100μm. The experimental results indicate that PLZT can be used to stretch the tiny displacement with light that dynamic characteristic can meet the requirement of optical drive.
UR - https://www.scopus.com/pages/publications/44949152807
U2 - 10.1109/MESA.2006.296973
DO - 10.1109/MESA.2006.296973
M3 - 会议稿件
AN - SCOPUS:44949152807
SN - 0780397215
SN - 9780780397217
T3 - Proceedings of the 2nd IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications, MESA 2006
BT - Proceedings of the 2nd IEEE/ASME International Conference on Mechatronic and mbedded Systems and Applications, MESA 2006
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2nd IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications, MESA 2006
Y2 - 13 August 2006 through 16 August 2006
ER -