Brittle behavior of gold alloy joint soldered with tin-lead solder

Na Yin; Wenqing Qu; Shujuan Yang; Rui Li

Brittle behavior of gold alloy joint soldered with tin-lead solder

Na Yin^*
, Wenqing Qu
, Shujuan Yang
, Rui Li

^*此作品的通讯作者

机械工程及自动化学院

Beihang University
CAS - Beijing Institute of Control Engineering

科研成果: 期刊稿件 › 文章 › 同行评审

4 引用（Scopus）

摘要

Soldering of Au60AgCu using tin-lead solder was performed in the experiment. The soldering joint of microstructure, micro-hardness, phase composition, mechanical properties and fracture morphology were analyzed, and the effect of interface intermetallic compound on joint brittleness was discussed. It was found that the compound of Au60AgCu alloy soldering joint was composed of AuSn₂, Ag₃Sn and AuSn₄. With increasing the soldering temperature and/or time, the thickness of intermetallic compound was obviously increased. The hardness of intermetallic compound was high. The soldering joint of shear mechanical property test indicates that fracture occurred in the intermetallic compound layer, and the fracture morphology is brittle fracture.

源语言	英语
页（从-至）	670-673
页数	4
期刊	Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics
卷	39
期	5
出版状态	已出版 - 5月 2013

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title = "Brittle behavior of gold alloy joint soldered with tin-lead solder",

abstract = "Soldering of Au60AgCu using tin-lead solder was performed in the experiment. The soldering joint of microstructure, micro-hardness, phase composition, mechanical properties and fracture morphology were analyzed, and the effect of interface intermetallic compound on joint brittleness was discussed. It was found that the compound of Au60AgCu alloy soldering joint was composed of AuSn2, Ag3Sn and AuSn4. With increasing the soldering temperature and/or time, the thickness of intermetallic compound was obviously increased. The hardness of intermetallic compound was high. The soldering joint of shear mechanical property test indicates that fracture occurred in the intermetallic compound layer, and the fracture morphology is brittle fracture.",

keywords = "Au60AgCu alloy, Brittle fracture, Intermetallic compound, Tin-lead solder",

author = "Na Yin and Wenqing Qu and Shujuan Yang and Rui Li",

year = "2013",

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language = "英语",

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pages = "670--673",

journal = "Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics",

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publisher = "Beijing University of Aeronautics and Astronautics (BUAA)",

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TY - JOUR

T1 - Brittle behavior of gold alloy joint soldered with tin-lead solder

AU - Yin, Na

AU - Qu, Wenqing

AU - Yang, Shujuan

AU - Li, Rui

PY - 2013/5

Y1 - 2013/5

N2 - Soldering of Au60AgCu using tin-lead solder was performed in the experiment. The soldering joint of microstructure, micro-hardness, phase composition, mechanical properties and fracture morphology were analyzed, and the effect of interface intermetallic compound on joint brittleness was discussed. It was found that the compound of Au60AgCu alloy soldering joint was composed of AuSn2, Ag3Sn and AuSn4. With increasing the soldering temperature and/or time, the thickness of intermetallic compound was obviously increased. The hardness of intermetallic compound was high. The soldering joint of shear mechanical property test indicates that fracture occurred in the intermetallic compound layer, and the fracture morphology is brittle fracture.

AB - Soldering of Au60AgCu using tin-lead solder was performed in the experiment. The soldering joint of microstructure, micro-hardness, phase composition, mechanical properties and fracture morphology were analyzed, and the effect of interface intermetallic compound on joint brittleness was discussed. It was found that the compound of Au60AgCu alloy soldering joint was composed of AuSn2, Ag3Sn and AuSn4. With increasing the soldering temperature and/or time, the thickness of intermetallic compound was obviously increased. The hardness of intermetallic compound was high. The soldering joint of shear mechanical property test indicates that fracture occurred in the intermetallic compound layer, and the fracture morphology is brittle fracture.

KW - Au60AgCu alloy

KW - Brittle fracture

KW - Intermetallic compound

KW - Tin-lead solder

UR - https://www.scopus.com/pages/publications/84878913625

M3 - 文章

AN - SCOPUS:84878913625

SN - 1001-5965

VL - 39

SP - 670

EP - 673

JO - Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics

JF - Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics

IS - 5

ER -

Brittle behavior of gold alloy joint soldered with tin-lead solder

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