Assembly process research of to package power transistor in aerospace electronic products

Ningning Wang; Qiong Wu; Zongpeng He; Zhenming Zhang; Wei Zhang

doi:10.1109/ICEPT.2014.6922669

Assembly process research of to package power transistor in aerospace electronic products

Ningning Wang^*
, Qiong Wu
, Zongpeng He
, Zhenming Zhang
, Wei Zhang

^*此作品的通讯作者

China Aerospace Science and Technology Corporation
Harbin Institute of Technology

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

In this paper, two processes which are adopted to produce TO packaged power devices are concerned about. The relationship between process factors and equivalent stress and deformation in the joint are studied. Finite element simulation method is adopted to analyze the equivalent stress, strain and deformation in the two processes. Results indicate that both the two processes produce large equivalent stresses, which are over 180MPa. The peak stress locates at the root of contact area of leg and pipe. On the whole, welding stress of process A is larger due to the relatively larger mechanical restraint. To improve the long term reliability for the TO package products, here we put forward a new process, by which smaller equivalent stress is produced.

源语言	英语
主期刊名	2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014
编辑	Keyun Bi, Zhong Tian, Ziqiang Xu
出版商	Institute of Electrical and Electronics Engineers Inc.
页	343-346
页数	4
ISBN（电子版）	9781479947072
DOI	https://doi.org/10.1109/ICEPT.2014.6922669
出版状态	已出版 - 13 10月 2014
已对外发布	是
活动	2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 - Chengdu, 中国期限: 12 8月 2014 → 15 8月 2014

出版系列

姓名	Proceedings of the Electronic Packaging Technology Conference, EPTC

会议

会议	2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014
国家/地区	中国
市	Chengdu
时期	12/08/14 → 15/08/14

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10.1109/ICEPT.2014.6922669

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Wang, N., Wu, Q., He, Z., Zhang, Z., & Zhang, W. (2014). Assembly process research of to package power transistor in aerospace electronic products. 在 K. Bi, Z. Tian, & Z. Xu (编辑), 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 (页码 343-346). 文章 6922669 (Proceedings of the Electronic Packaging Technology Conference, EPTC). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT.2014.6922669

Wang, Ningning ; Wu, Qiong ; He, Zongpeng 等. / Assembly process research of to package power transistor in aerospace electronic products. 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014. 编辑 / Keyun Bi ; Zhong Tian ; Ziqiang Xu. Institute of Electrical and Electronics Engineers Inc., 2014. 页码 343-346 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

@inproceedings{08c5cbedeefe4c7b8518f25d08e86667,

title = "Assembly process research of to package power transistor in aerospace electronic products",

abstract = "In this paper, two processes which are adopted to produce TO packaged power devices are concerned about. The relationship between process factors and equivalent stress and deformation in the joint are studied. Finite element simulation method is adopted to analyze the equivalent stress, strain and deformation in the two processes. Results indicate that both the two processes produce large equivalent stresses, which are over 180MPa. The peak stress locates at the root of contact area of leg and pipe. On the whole, welding stress of process A is larger due to the relatively larger mechanical restraint. To improve the long term reliability for the TO package products, here we put forward a new process, by which smaller equivalent stress is produced.",

author = "Ningning Wang and Qiong Wu and Zongpeng He and Zhenming Zhang and Wei Zhang",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 ; Conference date: 12-08-2014 Through 15-08-2014",

year = "2014",

month = oct,

day = "13",

doi = "10.1109/ICEPT.2014.6922669",

language = "英语",

series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "343--346",

editor = "Keyun Bi and Zhong Tian and Ziqiang Xu",

booktitle = "2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014",

address = "美国",

}

Wang, N, Wu, Q, He, Z, Zhang, Z & Zhang, W 2014, Assembly process research of to package power transistor in aerospace electronic products. 在 K Bi, Z Tian & Z Xu (编辑), 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014., 6922669, Proceedings of the Electronic Packaging Technology Conference, EPTC, Institute of Electrical and Electronics Engineers Inc., 页码 343-346, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, Chengdu, 中国, 12/08/14. https://doi.org/10.1109/ICEPT.2014.6922669

Assembly process research of to package power transistor in aerospace electronic products. / Wang, Ningning; Wu, Qiong; He, Zongpeng 等.
2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014. 编辑 / Keyun Bi; Zhong Tian; Ziqiang Xu. Institute of Electrical and Electronics Engineers Inc., 2014. 页码 343-346 6922669 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

TY - GEN

T1 - Assembly process research of to package power transistor in aerospace electronic products

AU - Wang, Ningning

AU - Wu, Qiong

AU - He, Zongpeng

AU - Zhang, Zhenming

AU - Zhang, Wei

PY - 2014/10/13

Y1 - 2014/10/13

N2 - In this paper, two processes which are adopted to produce TO packaged power devices are concerned about. The relationship between process factors and equivalent stress and deformation in the joint are studied. Finite element simulation method is adopted to analyze the equivalent stress, strain and deformation in the two processes. Results indicate that both the two processes produce large equivalent stresses, which are over 180MPa. The peak stress locates at the root of contact area of leg and pipe. On the whole, welding stress of process A is larger due to the relatively larger mechanical restraint. To improve the long term reliability for the TO package products, here we put forward a new process, by which smaller equivalent stress is produced.

AB - In this paper, two processes which are adopted to produce TO packaged power devices are concerned about. The relationship between process factors and equivalent stress and deformation in the joint are studied. Finite element simulation method is adopted to analyze the equivalent stress, strain and deformation in the two processes. Results indicate that both the two processes produce large equivalent stresses, which are over 180MPa. The peak stress locates at the root of contact area of leg and pipe. On the whole, welding stress of process A is larger due to the relatively larger mechanical restraint. To improve the long term reliability for the TO package products, here we put forward a new process, by which smaller equivalent stress is produced.

UR - https://www.scopus.com/pages/publications/84908086512

U2 - 10.1109/ICEPT.2014.6922669

DO - 10.1109/ICEPT.2014.6922669

M3 - 会议稿件

AN - SCOPUS:84908086512

T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC

SP - 343

EP - 346

BT - 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014

A2 - Bi, Keyun

A2 - Tian, Zhong

A2 - Xu, Ziqiang

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014

Y2 - 12 August 2014 through 15 August 2014

ER -

Wang N, Wu Q, He Z, Zhang Z, Zhang W. Assembly process research of to package power transistor in aerospace electronic products. 在 Bi K, Tian Z, Xu Z, 编辑, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014. Institute of Electrical and Electronics Engineers Inc. 2014. 页码 343-346. 6922669. (Proceedings of the Electronic Packaging Technology Conference, EPTC). doi: 10.1109/ICEPT.2014.6922669

Assembly process research of to package power transistor in aerospace electronic products

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