Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate

As thermal protection substrates for wearable electronics, functional soft composites made of polymer materials embedded with phase change materials and metal layers demonstrate unique capabilities for the thermal protection of human skin. Here, we develop an analytical transient phase change heat transfer model to investigate the thermal performance of a wearable electronic device with a thermal protection substrate. The model is validated by experiments and the finite element analysis (FEA). The effects of the substrate structure size and heat source power input on the temperature management efficiency are investigated systematically and comprehensively. The results show that the objective of thermal management for wearable electronics is achieved by the following thermal protection mechanism. The metal thin film helps to dissipate heat along the in-plane direction by reconfiguring the direction of heat flow, while the phase change material assimilates excessive heat. These results will not only promote the fundamental understanding of the thermal properties of wearable electronics incorporating thermal protection substrates, but also facilitate the rational design of thermal protection substrates for wearable electronics.