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Analytical model of adhesively bonded composite double-lap joints containing a fully or non-fully debond flaw

  • Beihang University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Adhesive bonding technology is widely applied in the assembly and repair processes of composite laminates. However, the debond flaws existing in the adhesive layer weakens the load-carrying capacity of adhesively bonded structures. This article presents an analytical model to investigate the adhesive shear behaviour of double-lap joints containing a debond flaw. Differential element method is employed to simulate the stress and strain distribution of adhesive layer, which considers anisotropy of each ply in the composite laminates and elastic-perfectly plastic behaviour of the adhesive. This model can compute the stress and stiffness of adhesive double-lap joints with different debond flaw conditions, covering fully debond ones as well as non-fully ones. Finite element model of double-lap joints is built in this paper to validate the accuracy of proposed analytical model. We also compared the debond flaw joints and non-flaw ones in terms of their adhesive strain and stress distribution.

源语言英语
主期刊名ICSRT 2018 - Proceedings of 2018 International Conference on Service Robotics Technologies
出版商Association for Computing Machinery
78-83
页数6
ISBN(电子版)9781450364348
DOI
出版状态已出版 - 16 3月 2018
活动2018 International Conference on Service Robotics Technologies, ICSRT 2018 - Chengdu, 中国
期限: 16 3月 201819 3月 2018

出版系列

姓名ACM International Conference Proceeding Series

会议

会议2018 International Conference on Service Robotics Technologies, ICSRT 2018
国家/地区中国
Chengdu
时期16/03/1819/03/18

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