TY - GEN
T1 - Analysis of the Damage Characteristics of Integrated Circuits with Various Pulse Width
AU - Lu, Fu
AU - Zhaowen, Yan
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This research aims to propose an effective and low-cost solution for Electromagnetic compatibility (EMC) of integrated circuits, and comprehensively understand the impact of electrostatic discharge (ESD) on integrated circuits. The transient IV curves of integrated circuits were compared and analyzed. The transient conduction damage of integrated circuits under different pulse widths was studied. The results indicate that the comparison of transient IV curves and the characteristics of transient conduction damage have certain regularity.
AB - This research aims to propose an effective and low-cost solution for Electromagnetic compatibility (EMC) of integrated circuits, and comprehensively understand the impact of electrostatic discharge (ESD) on integrated circuits. The transient IV curves of integrated circuits were compared and analyzed. The transient conduction damage of integrated circuits under different pulse widths was studied. The results indicate that the comparison of transient IV curves and the characteristics of transient conduction damage have certain regularity.
KW - integrated circuits (ICs)
KW - transient IV curves
KW - transient damage characteristics
KW - transmission line pulse(TLP)
UR - https://www.scopus.com/pages/publications/85182740131
U2 - 10.1109/ISEMC58300.2023.10370508
DO - 10.1109/ISEMC58300.2023.10370508
M3 - 会议稿件
AN - SCOPUS:85182740131
T3 - IEEE International Symposium on Electromagnetic Compatibility
BT - 7th International Symposium on Electromagnetic Compatibility, ISEMC 2023 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th IEEE International Symposium on Electromagnetic Compatibility, ISEMC 2023
Y2 - 20 October 2023 through 23 October 2023
ER -