Analysis of interfacial dislocations of wafer bonding by the O-lattice model

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源语言	英语
页（从-至）	147
页数	1
期刊	Bandaoti Guangdian/Semiconductor Optoelectronics
卷	25
期	2
出版状态	已出版 - 4月 2004

其它文件与链接

@article{5aa67c71e42d4e1a8c586fd6ee5e642c,

title = "Analysis of interfacial dislocations of wafer bonding by the O-lattice model",

author = "Zhen Zhou and Huang, \{Yong Qing\} and Ren, \{Xiao Min\}",

year = "2004",

month = apr,

language = "英语",

volume = "25",

pages = "147",

journal = "Bandaoti Guangdian/Semiconductor Optoelectronics",

issn = "1001-5868",

publisher = "China National Publishing Industry Trading Corporation",

number = "2",

}

TY - JOUR

T1 - Analysis of interfacial dislocations of wafer bonding by the O-lattice model

AU - Zhou, Zhen

AU - Huang, Yong Qing

AU - Ren, Xiao Min

PY - 2004/4

Y1 - 2004/4

UR - https://www.scopus.com/pages/publications/3142510603

M3 - 文章

AN - SCOPUS:3142510603

SN - 1001-5868

VL - 25

SP - 147

JO - Bandaoti Guangdian/Semiconductor Optoelectronics

JF - Bandaoti Guangdian/Semiconductor Optoelectronics

IS - 2

ER -