TY - GEN
T1 - An Improved Liquid Metal Mask Printing enabled Fast Fabrication of Wearable Electronics on Fabrics
AU - Guo, Rui
AU - Yao, Siyuan
AU - Sun, Xuyang
AU - Liu, Jing
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/7
Y1 - 2019/7
N2 - In this paper, a new improved mask printing method of liquid metal is developed, which realizes the fast fabrication of flexible electronics on fabrics. Here, polymethacrylates (PMA) glue is printed on fabrics to improve the adhesion effect of liquid metal (EGaIn) on fabrics. Combined with mask printing, liquid metal can be directly and rapidly printed on the fabrics with PMA glue to manufacture flexible electronics, such as LED array circuit, strain sensor and temperature monitoring circuit. With combined the advantages of favorable stretchability and rapid manufacture, the improved liquid metal mask printing method provides an approach with valuable prospects for individualized wearable health care devices. Besides, this method has extensive application prospect in mass production of smart electronic fabrics.
AB - In this paper, a new improved mask printing method of liquid metal is developed, which realizes the fast fabrication of flexible electronics on fabrics. Here, polymethacrylates (PMA) glue is printed on fabrics to improve the adhesion effect of liquid metal (EGaIn) on fabrics. Combined with mask printing, liquid metal can be directly and rapidly printed on the fabrics with PMA glue to manufacture flexible electronics, such as LED array circuit, strain sensor and temperature monitoring circuit. With combined the advantages of favorable stretchability and rapid manufacture, the improved liquid metal mask printing method provides an approach with valuable prospects for individualized wearable health care devices. Besides, this method has extensive application prospect in mass production of smart electronic fabrics.
UR - https://www.scopus.com/pages/publications/85077840614
U2 - 10.1109/EMBC.2019.8857044
DO - 10.1109/EMBC.2019.8857044
M3 - 会议稿件
C2 - 31946238
AN - SCOPUS:85077840614
T3 - Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
SP - 1761
EP - 1764
BT - 2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2019
Y2 - 23 July 2019 through 27 July 2019
ER -