An identification method of counterfeit components based on physical analysis test technology

Zhengping Chen; Sujuan Zhang; Yao Qiu

doi:10.1109/EDAPS.2017.8277025

An identification method of counterfeit components based on physical analysis test technology

可靠性与系统工程学院

Beihang University

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

2 引用（Scopus）

摘要

With the rise of counterfeiting, and counterfeit electronic components are widely used in various field. Although the components used in the military equipment are through the layers of quality checks before installed, there are still a lot of counterfeit components do not be checked out. In this paper, an identification method for counterfeit components based on physical analysis test techniques, such as visual inspection, scanning acoustic microscope (SAM) and scanning electron microscope (SEM) examination, was proposed. And a case was applied and analyzed, which indicated that the proposed method can identify counterfeit devices effectively.

源语言	英语
主期刊名	2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
出版商	Institute of Electrical and Electronics Engineers Inc.
页	1-4
页数	4
ISBN（电子版）	9781538612385
DOI	https://doi.org/10.1109/EDAPS.2017.8277025
出版状态	已出版 - 2 7月 2017
活动	2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 - Haining, Zhejiang, 中国期限: 14 12月 2017 → 16 12月 2017

出版系列

姓名	2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
卷	2018-January

会议

会议	2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
国家/地区	中国
市	Haining, Zhejiang
时期	14/12/17 → 16/12/17

访问文件

10.1109/EDAPS.2017.8277025

其它文件与链接

链接到 Scopus 的出版物

引用此

Chen, Z., Zhang, S., & Qiu, Y. (2017). An identification method of counterfeit components based on physical analysis test technology. 在 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 (页码 1-4). (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; 卷 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2017.8277025

Chen, Zhengping ; Zhang, Sujuan ; Qiu, Yao. / An identification method of counterfeit components based on physical analysis test technology. 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 页码 1-4 (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017).

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title = "An identification method of counterfeit components based on physical analysis test technology",

abstract = "With the rise of counterfeiting, and counterfeit electronic components are widely used in various field. Although the components used in the military equipment are through the layers of quality checks before installed, there are still a lot of counterfeit components do not be checked out. In this paper, an identification method for counterfeit components based on physical analysis test techniques, such as visual inspection, scanning acoustic microscope (SAM) and scanning electron microscope (SEM) examination, was proposed. And a case was applied and analyzed, which indicated that the proposed method can identify counterfeit devices effectively.",

keywords = "counterfeit, physical analysis test technology, relabeling",

author = "Zhengping Chen and Sujuan Zhang and Yao Qiu",

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language = "英语",

series = "2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017",

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Chen, Z , Zhang, S & Qiu, Y 2017, An identification method of counterfeit components based on physical analysis test technology. 在 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017, 卷 2018-January, Institute of Electrical and Electronics Engineers Inc., 页码 1-4, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017, Haining, Zhejiang, 中国, 14/12/17. https://doi.org/10.1109/EDAPS.2017.8277025

An identification method of counterfeit components based on physical analysis test technology. / Chen, Zhengping ; Zhang, Sujuan; Qiu, Yao.
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 页码 1-4 (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; 卷 2018-January).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

TY - GEN

T1 - An identification method of counterfeit components based on physical analysis test technology

AU - Chen, Zhengping

AU - Zhang, Sujuan

AU - Qiu, Yao

PY - 2017/7/2

Y1 - 2017/7/2

N2 - With the rise of counterfeiting, and counterfeit electronic components are widely used in various field. Although the components used in the military equipment are through the layers of quality checks before installed, there are still a lot of counterfeit components do not be checked out. In this paper, an identification method for counterfeit components based on physical analysis test techniques, such as visual inspection, scanning acoustic microscope (SAM) and scanning electron microscope (SEM) examination, was proposed. And a case was applied and analyzed, which indicated that the proposed method can identify counterfeit devices effectively.

AB - With the rise of counterfeiting, and counterfeit electronic components are widely used in various field. Although the components used in the military equipment are through the layers of quality checks before installed, there are still a lot of counterfeit components do not be checked out. In this paper, an identification method for counterfeit components based on physical analysis test techniques, such as visual inspection, scanning acoustic microscope (SAM) and scanning electron microscope (SEM) examination, was proposed. And a case was applied and analyzed, which indicated that the proposed method can identify counterfeit devices effectively.

KW - counterfeit

KW - physical analysis test technology

KW - relabeling

UR - https://www.scopus.com/pages/publications/85050479109

U2 - 10.1109/EDAPS.2017.8277025

DO - 10.1109/EDAPS.2017.8277025

M3 - 会议稿件

AN - SCOPUS:85050479109

T3 - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017

SP - 1

EP - 4

BT - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017

Y2 - 14 December 2017 through 16 December 2017

ER -

Chen Z , Zhang S, Qiu Y. An identification method of counterfeit components based on physical analysis test technology. 在 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. 页码 1-4. (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017). doi: 10.1109/EDAPS.2017.8277025

An identification method of counterfeit components based on physical analysis test technology

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