跳到主要导航 跳到搜索 跳到主要内容

An experimental setup to test thermal contact conductance across solid/solid interface

  • Shengwang Liu*
  • , Weifang Zhang
  • , Qingyun Tang
  • *此作品的通讯作者
  • Beihang University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

This article describes an experimental setup to measure the TCC between interfaces of two contact solid materials. This apparatus consists of loading and load bearing subsystem, water-cooling subsystem, heating subsystem, temperature measurement and control subsystem and thermal insulation subsystem. A new kind of design scheme of the compensation heater is put forward. An experimental investigation of TCC is conducted with pressed pairs of TC4/30CrMnSi contacts in the range 40∼140MPa. The results show that TCC over this condition increases with load, and is greater in the process of unloading than that of loading under the same condition.

源语言英语
主期刊名Materials Processing Technology
1293-1296
页数4
DOI
出版状态已出版 - 2011
活动2011 International Conference on Advanced Engineering Materials and Technology, AEMT 2011 - Sanya, 中国
期限: 29 7月 201131 7月 2011

出版系列

姓名Advanced Materials Research
291-294
ISSN(印刷版)1022-6680

会议

会议2011 International Conference on Advanced Engineering Materials and Technology, AEMT 2011
国家/地区中国
Sanya
时期29/07/1131/07/11

指纹

探究 'An experimental setup to test thermal contact conductance across solid/solid interface' 的科研主题。它们共同构成独一无二的指纹。

引用此