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An Efficient Planar Bundle Adjustment Algorithm

  • Lipu Zhou
  • , Daniel Koppel
  • , Hul Ju
  • , Frank Steinbruecker
  • , Michael Kaess
  • Magic Leap
  • Carnegie Mellon University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

This paper presents an efficient algorithm for the least-squares problem using the point-to-plane cost, which aims to jointly optimize depth sensor poses and plane parameters for 3D reconstruction. We call this least-squares problem Planar Bundle Adjustment (PBA), due to the similarity between this problem and the original Bundle Adjustment (BA) in visual reconstruction. As planes ubiquitously exist in the man-made environment, they are generally used as landmarks in SLAM algorithms for various depth sensors. PBA is important to reduce drift and improve the quality of the map. However, directly adopting the well-established BA framework in visual reconstruction will result in a very inefficient solution for PBA. This is because a 3D point only has one observation at a camera pose. In contrast, a depth sensor can record hundreds of points in a plane at a time, which results in a very large nonlinear least-squares problem even for a small-scale space. The main contribution of this paper is an efficient solution for the PBA problem using the point-to-plane cost. We introduce a reduced Jacobian matrix and a reduced residual vector, and prove that they can replace the original Jacobian matrix and residual vector in the generally adopted Levenberg-Marquardt (LM) algorithm. This significantly reduces the computational cost. Besides, when planes are combined with other features for 3D reconstruction, the reduced Jacobian matrix and residual vector can also replace the corresponding parts derived from planes. Our experimental results show that our algorithm can significantly reduce the computational time compared to the solution using the traditional BA framework. In addition, our algorithm is faster, more accurate, and more robust to initialization errors compared to the start-of-the-art solution using the plane-to-plane cost [3].

源语言英语
主期刊名Proceedings - 2020 IEEE International Symposium on Mixed and Augmented Reality, ISMAR 2020
出版商Institute of Electrical and Electronics Engineers Inc.
136-145
页数10
ISBN(电子版)9781728185088
DOI
出版状态已出版 - 11月 2020
已对外发布
活动19th IEEE International Symposium on Mixed and Augmented Reality, ISMAR 2020 - Virtual, Recife/Porto de Galinhas, 巴西
期限: 9 11月 202013 11月 2020

出版系列

姓名Proceedings - 2020 IEEE International Symposium on Mixed and Augmented Reality, ISMAR 2020

会议

会议19th IEEE International Symposium on Mixed and Augmented Reality, ISMAR 2020
国家/地区巴西
Virtual, Recife/Porto de Galinhas
时期9/11/2013/11/20

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