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An Efficient and Accurate SIE Formulation with Loop Analysis for Arbitrary-Shaped Interconnects

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

A novel method is proposed for extracting the impedance of interconnects in packages. This method uses the magneto-quasi-static (MQS) surface integral equation (SIE) formulation with loop analysis. By using graph theory, the loop analysis is developed with a set of unknowns that are independent and complete, which can reduce the complexity of the final matrix equation. The pre-corrected fast Fourier Transform (pFFT) algorithm is carried out to speed up the matrix-vector product. To validate the proposed method, a real-life example in packages is presented. The results show that the proposed method can accurately and flexibly model complex interconnects in packages compared to the existing industrial solver.

源语言英语
主期刊名2023 International Applied Computational Electromagnetics Society Symposium, ACES-China 2023
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781733509657
DOI
出版状态已出版 - 2023
活动2023 International Applied Computational Electromagnetics Society Symposium, ACES-China 2023 - Hangzhou, 中国
期限: 15 8月 202318 8月 2023

出版系列

姓名2023 International Applied Computational Electromagnetics Society Symposium, ACES-China 2023

会议

会议2023 International Applied Computational Electromagnetics Society Symposium, ACES-China 2023
国家/地区中国
Hangzhou
时期15/08/2318/08/23

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