TY - JOUR
T1 - Advanced die-level assembly techniques and quality analysis for phase-only liquid crystal on silicon devices
AU - Zhang, Zichen
AU - Pivnenko, Mike
AU - Medina-Salazar, Ivonne
AU - You, Zheng
AU - Chu, Daping
N1 - Publisher Copyright:
© IMechE 2015.
PY - 2016/9/1
Y1 - 2016/9/1
N2 - In this article, quality analysis of the assembled phase-only liquid crystal on silicon devices is presented based on experiences using the flexibility and scalability of die-level assembly process. The research contents mainly consist of quality control and optimisation of liquid crystal filling process and device overall quality assessment including the thickness uniformity of liquid crystal layer with post-assembly inspection. To summarise, pre-production prototype phase-only liquid crystal on silicon devices with high quality has been developed in high reproducibility using a die-level assembly process, the robust glue deposition is performed, liquid crystal filling process in isotropic phase is presented and thickness variation can be controlled in the range of γ/4.
AB - In this article, quality analysis of the assembled phase-only liquid crystal on silicon devices is presented based on experiences using the flexibility and scalability of die-level assembly process. The research contents mainly consist of quality control and optimisation of liquid crystal filling process and device overall quality assessment including the thickness uniformity of liquid crystal layer with post-assembly inspection. To summarise, pre-production prototype phase-only liquid crystal on silicon devices with high quality has been developed in high reproducibility using a die-level assembly process, the robust glue deposition is performed, liquid crystal filling process in isotropic phase is presented and thickness variation can be controlled in the range of γ/4.
KW - Liquid crystal on silicon
KW - die-level assembly
KW - liquid crystal filling
KW - phase-only
UR - https://www.scopus.com/pages/publications/84986305877
U2 - 10.1177/0954405415578583
DO - 10.1177/0954405415578583
M3 - 文章
AN - SCOPUS:84986305877
SN - 0954-4054
VL - 230
SP - 1659
EP - 1664
JO - Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
JF - Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
IS - 9
ER -