TY - GEN
T1 - A Survey on Metaverse
T2 - 9th IEEE Smart World Congress, SWC 2023
AU - Yang, Yilong
AU - Cheng, Yuyu
AU - Gao, Juntao
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - In recent years, the metaverse has experienced significant growth and has garnered much attention, but most people tend to see only the economic value of the metaverse and ignore the technical principles and challenges of the industry that may limit its development. In this paper, we conduct a systematic mapping study to analyze and summarize the literature in the following four key dimensions: a) the concepts of the metaverse, b) examining the supporting technologies, including artificial intelligence, blockchain, interaction technology, digital twin, web, and rendering technology, c) investigating various applications of the metaverse, d) identifying future trends and challenges in development. This survey provides a comprehensive overview of the metaverse and offers insights for future work in this area.
AB - In recent years, the metaverse has experienced significant growth and has garnered much attention, but most people tend to see only the economic value of the metaverse and ignore the technical principles and challenges of the industry that may limit its development. In this paper, we conduct a systematic mapping study to analyze and summarize the literature in the following four key dimensions: a) the concepts of the metaverse, b) examining the supporting technologies, including artificial intelligence, blockchain, interaction technology, digital twin, web, and rendering technology, c) investigating various applications of the metaverse, d) identifying future trends and challenges in development. This survey provides a comprehensive overview of the metaverse and offers insights for future work in this area.
KW - challenges
KW - future trends
KW - metaverse
KW - technical principles
UR - https://www.scopus.com/pages/publications/85187364002
U2 - 10.1109/SWC57546.2023.10449330
DO - 10.1109/SWC57546.2023.10449330
M3 - 会议稿件
AN - SCOPUS:85187364002
T3 - Proceedings - 2023 IEEE SmartWorld, Ubiquitous Intelligence and Computing, Autonomous and Trusted Vehicles, Scalable Computing and Communications, Digital Twin, Privacy Computing and Data Security, Metaverse, SmartWorld/UIC/ATC/ScalCom/DigitalTwin/PCDS/Metaverse 2023
BT - Proceedings - 2023 IEEE SmartWorld, Ubiquitous Intelligence and Computing, Autonomous and Trusted Vehicles, Scalable Computing and Communications, Digital Twin, Privacy Computing and Data Security, Metaverse, SmartWorld/UIC/ATC/ScalCom/DigitalTwin/PCDS/Metaverse 2023
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 28 August 2023 through 31 August 2023
ER -