TY - GEN
T1 - A solder joint crack - Characteristic impedance model based on transmission line theory
AU - Liu, Ziwei
AU - Sun, Yufeng
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/5/13
Y1 - 2014/5/13
N2 - A solder joint crack - characteristic impedance model has been established in this paper. Under high frequency operational condition, signal integrity is important to the reliability of electronic products. Solder joint crack will change the characteristic impedance of transmission channel, and then will affect the signal integrity. So establishing the model of solder joint crack and characteristic impedance could connect solder joint crack with signal distortion together. It is meaningful to determining the failure threshold of the solder joint, so as to achieve the purpose of health monitoring and preventive maintenance. In this paper, the transmission line theory and reflection parameter have been analyzed. And then the physical model of damaged solder joint has been simplified. On these bases, the transmission line electrical model of the solder joint has been established. After that, the characteristic impedance of the damaged solder joint is deduced and the model of solder joint crack - characteristic impedance is obtained. In this process, both skin effect and parasitic effect have been considered. At last, the application process of this model is given. Moreover, this model is verified by experimental data and the result shows that the model is effective and the mean error is fewer.
AB - A solder joint crack - characteristic impedance model has been established in this paper. Under high frequency operational condition, signal integrity is important to the reliability of electronic products. Solder joint crack will change the characteristic impedance of transmission channel, and then will affect the signal integrity. So establishing the model of solder joint crack and characteristic impedance could connect solder joint crack with signal distortion together. It is meaningful to determining the failure threshold of the solder joint, so as to achieve the purpose of health monitoring and preventive maintenance. In this paper, the transmission line theory and reflection parameter have been analyzed. And then the physical model of damaged solder joint has been simplified. On these bases, the transmission line electrical model of the solder joint has been established. After that, the characteristic impedance of the damaged solder joint is deduced and the model of solder joint crack - characteristic impedance is obtained. In this process, both skin effect and parasitic effect have been considered. At last, the application process of this model is given. Moreover, this model is verified by experimental data and the result shows that the model is effective and the mean error is fewer.
KW - Characteristic impedance
KW - Crack
KW - Signal integrity
KW - Solder joint
UR - https://www.scopus.com/pages/publications/84949928925
U2 - 10.1109/ICRMS.2014.7107178
DO - 10.1109/ICRMS.2014.7107178
M3 - 会议稿件
AN - SCOPUS:84949928925
T3 - ICRMS 2014 - Proceedings of 2014 10th International Conference on Reliability, Maintainability and Safety: More Reliable Products, More Secure Life
SP - 237
EP - 241
BT - ICRMS 2014 - Proceedings of 2014 10th International Conference on Reliability, Maintainability and Safety
A2 - En, Yunfei
A2 - Ji, Chunyang
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 10th International Conference on Reliability, Maintainability and Safety, ICRMS 2014
Y2 - 6 August 2014 through 8 August 2014
ER -