@inproceedings{06ba8476995944bcbc38d1bf0dbe43c5,
title = "A Reliability Assessment Approach for GaN-Based Power Supply",
abstract = "The impact of GaN devices on reliability of switch mode power supply (SMPS) is one of the research hotspots in recent years. This paper proposes a reliability assessment method for SMPS with GaN transistor. A simulation model with 3 cells for on-resistance of GaN transistors is proposed. A test platform is used to extract model parameters under different operation conditions. Test results have found that the on-resistance of the GaN device doubled after 50 seconds at 400V bias. after 10 seconds of on-state, the on-resistance drops to a rated value. Then, circuit simulation is carried out to assess the impact of aged GaN transistors on the performance of SMPS. Simulation results have found that after 180 minutes of SMPS operation, the on-resistance of the GaN device rises by 80\%, while the efficiency of the power supply drops by 0.1\%. Using the simulation model it is possible to calculate the efficiency of the SMPS after long working hours.",
keywords = "GaN Device, Reliability, Switch Mode Power Supply",
author = "Liang Jinghao and Sun Bo and Guo Chunbing and Cui Chengqiang",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 23rd International Conference on Electronic Packaging Technology, ICEPT 2022 ; Conference date: 10-08-2022 Through 13-08-2022",
year = "2022",
doi = "10.1109/ICEPT56209.2022.9872649",
language = "英语",
series = "2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022",
address = "美国",
}