A parametric conducted emission modeling method of a switching model power supply (SMPS) chip by a developed vector fitting algorithm

This paper proposes a modeling method to establish a parametric-conducted emission model of a switching model power supply (SMPS) chip through a developed vector fitting algorithm. A common SMPS chip LTM8025 was taken as an example to explain the modeling process. According to the integrated circuit (IC) electromagnetic modeling (ICEM) standard, the parametric conducted emission model is divided into two parts: IC internal activity (ICIA) and IC passive distribution network (ICPDN). The parameters of ICIA are identified by measured data and correlated with key components; an improved vector-fitting algorithm is proposed to solve the fitting problem of ICPDN without phase information. This parametric model can be used with commercial simulation software together to achieve predictions of conducted emissions from power modules. The experiment results show that the maximum and 90% confidence interval of the forecast errors are 9.677 dB and (−4.56 dB, 6.52 dB) respectively, which achieve the international standard requirements and have sufficient accuracy and effectiveness.