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A Novel All-Digital on-Chip Aging Sensor Robust to Process Variations

  • Beihang University
  • Zhongguancun Laboratory

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

With the development of semiconductor technology, the reliability of integrated circuit (IC) is challenged by multiple aging mechanisms, which could increase the delay of ICs and cause timing violations. Hence, it is necessary to monitor the aging degree of the IC in real time. In this paper, we present a novel on-chip aging sensor based on path delay measurement, which can perform accurate measurement in two clock cycles. The proposed sensor is all-digital with low area overhead. Experiment result shows that the random measurement error is less than 2.92ps during 2 years aging. In addition, the sensor is robust to process variations.

源语言英语
主期刊名2022 7th International Conference on Integrated Circuits and Microsystems, ICICM 2022
出版商Institute of Electrical and Electronics Engineers Inc.
578-583
页数6
ISBN(电子版)9781665460439
DOI
出版状态已出版 - 2022
活动7th International Conference on Integrated Circuits and Microsystems, ICICM 2022 - Xi'an, 中国
期限: 28 10月 202231 10月 2022

出版系列

姓名2022 7th International Conference on Integrated Circuits and Microsystems, ICICM 2022

会议

会议7th International Conference on Integrated Circuits and Microsystems, ICICM 2022
国家/地区中国
Xi'an
时期28/10/2231/10/22

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