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A Neural Network-Based Performance Assessment Approach for Heat-Dissipating Microchannels in Packages

  • Bo Sun*
  • , Zhenhao Tang
  • , Kunzhao Li
  • , Chunbing Guo
  • *此作品的通讯作者
  • Guangdong University of Technology

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

To address the severe computational bottleneck imposed by three-dimensional conjugate heat transfer (CHT) simulations in the thermal design of micro-channel heat sinks (MCHSs), this study develops a high-throughput automated CFD pipeline that integrates geometric feasibility constraints with a cryptographic SHA256-based data-freezing mechanism. From 791 randomly generated designs with extreme geometric characteristics, 638 valid high-fidelity structured samples were retained after strict numerical and geometric screening. On this physically consistent dataset, a physics-informed machine learning (PIML) surrogate was established to map core geometric and derived features to multi-objective thermo-hydraulic responses. For the most challenging target, pressure drop, fluid-mechanics priors including v2 and 1/Dh were explicitly injected into the learning space to improve robustness under highly nonlinear operating conditions. Quantitative results show that the surrogate achieved R2 >.094 on key heat-transfer-related targets such as Nu, maintained a global average MAPE of approximately 567. %, and constrained the local error in the extreme high-pressure-drop regime to 907. %. By replacing kilosecond-level CFD iterations with millisecond-level forward inference, the proposed framework delivered an acceleration of up to O(106) relative to conventional CFD, enabling real-time design-space exploration for next-generation chip thermal management.

源语言英语
主期刊名Proceedings - 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9798331562496
DOI
出版状态已出版 - 2026
已对外发布
活动27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026 - Warsaw, 波兰
期限: 19 4月 202622 4月 2026

出版系列

姓名Proceedings - 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026

会议

会议27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026
国家/地区波兰
Warsaw
时期19/04/2622/04/26

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