A Method of Extracting Transmission Characteristics of Interconnects from Near-Field Emissions in PCBs

This paper proposes a method for extracting transmission characteristics of interconnects in printed circuit boards (PCBs) from near-field emission. A wideband microstrip line electric probe is used to measure the near-field emission. There are two key technologies in the extraction principle, obtaining the transfer function and the input signal estimation, and they are explained in detail. To validate the method, one-trace structures, including a corner trace and a via trace, and a multi-trace structure were measured. The transmission characteristics extracted by the proposed method agrees well with the standard vector network analyzer (VNA) measurements up to frequency of 12 GHz. The error caused by the distance and the disturbance signal is investigated.