A fatigue life model of BGA solder joints based on energy

Jiamin Liu; Weiwei Hu; Hao Chen; Jiuxing Wang

doi:10.1109/ICRSE.2017.8030795

A fatigue life model of BGA solder joints based on energy

Jiamin Liu
, Weiwei Hu
, Hao Chen
, Jiuxing Wang

可靠性与系统工程学院

Beihang University

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

3 引用（Scopus）

摘要

In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.

源语言	英语
主期刊名	2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017
编辑	Dongming Fan, Jun Yang, Ziyao Wang, Tingdi Zhao
出版商	Institute of Electrical and Electronics Engineers Inc.
ISBN（电子版）	9781538609187
DOI	https://doi.org/10.1109/ICRSE.2017.8030795
出版状态	已出版 - 8 9月 2017
活动	2nd International Conference on Reliability Systems Engineering, ICRSE 2017 - Huairou, Beijing, 中国期限: 10 7月 2017 → 12 7月 2017

出版系列

姓名	2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017

会议

会议	2nd International Conference on Reliability Systems Engineering, ICRSE 2017
国家/地区	中国
市	Huairou, Beijing
时期	10/07/17 → 12/07/17

联合国可持续发展目标

此成果有助于实现下列可持续发展目标：

可持续发展目标 7 经济适用的清洁能源

访问文件

10.1109/ICRSE.2017.8030795

其它文件与链接

链接到 Scopus 的出版物

引用此

Liu, J., Hu, W., Chen, H., & Wang, J. (2017). A fatigue life model of BGA solder joints based on energy. 在 D. Fan, J. Yang, Z. Wang, & T. Zhao (编辑), 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017 文章 8030795 (2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICRSE.2017.8030795

Liu, Jiamin ; Hu, Weiwei ; Chen, Hao 等. / A fatigue life model of BGA solder joints based on energy. 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017. 编辑 / Dongming Fan ; Jun Yang ; Ziyao Wang ; Tingdi Zhao. Institute of Electrical and Electronics Engineers Inc., 2017. (2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017).

@inproceedings{9f3a03a4a6144deb84ada4ea605a9938,

title = "A fatigue life model of BGA solder joints based on energy",

abstract = "In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.",

keywords = "accelerated test, BGA solder joints, life prediction, simulation, thermal fatigue",

author = "Jiamin Liu and Weiwei Hu and Hao Chen and Jiuxing Wang",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2nd International Conference on Reliability Systems Engineering, ICRSE 2017 ; Conference date: 10-07-2017 Through 12-07-2017",

year = "2017",

month = sep,

day = "8",

doi = "10.1109/ICRSE.2017.8030795",

language = "英语",

series = "2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

editor = "Dongming Fan and Jun Yang and Ziyao Wang and Tingdi Zhao",

booktitle = "2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017",

address = "美国",

}

Liu, J, Hu, W, Chen, H & Wang, J 2017, A fatigue life model of BGA solder joints based on energy. 在 D Fan, J Yang, Z Wang & T Zhao (编辑), 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017., 8030795, 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017, Institute of Electrical and Electronics Engineers Inc., 2nd International Conference on Reliability Systems Engineering, ICRSE 2017, Huairou, Beijing, 中国, 10/07/17. https://doi.org/10.1109/ICRSE.2017.8030795

A fatigue life model of BGA solder joints based on energy. / Liu, Jiamin; Hu, Weiwei; Chen, Hao 等.
2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017. 编辑 / Dongming Fan; Jun Yang; Ziyao Wang; Tingdi Zhao. Institute of Electrical and Electronics Engineers Inc., 2017. 8030795 (2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

TY - GEN

T1 - A fatigue life model of BGA solder joints based on energy

AU - Liu, Jiamin

AU - Hu, Weiwei

AU - Chen, Hao

AU - Wang, Jiuxing

PY - 2017/9/8

Y1 - 2017/9/8

N2 - In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.

AB - In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.

KW - accelerated test

KW - BGA solder joints

KW - life prediction

KW - simulation

KW - thermal fatigue

UR - https://www.scopus.com/pages/publications/85032259179

U2 - 10.1109/ICRSE.2017.8030795

DO - 10.1109/ICRSE.2017.8030795

M3 - 会议稿件

AN - SCOPUS:85032259179

T3 - 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017

BT - 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017

A2 - Fan, Dongming

A2 - Yang, Jun

A2 - Wang, Ziyao

A2 - Zhao, Tingdi

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2nd International Conference on Reliability Systems Engineering, ICRSE 2017

Y2 - 10 July 2017 through 12 July 2017

ER -

Liu J, Hu W, Chen H, Wang J. A fatigue life model of BGA solder joints based on energy. 在 Fan D, Yang J, Wang Z, Zhao T, 编辑, 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017. Institute of Electrical and Electronics Engineers Inc. 2017. 8030795. (2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017). doi: 10.1109/ICRSE.2017.8030795

A fatigue life model of BGA solder joints based on energy

摘要

出版系列

会议

联合国可持续发展目标

访问文件

其它文件与链接

学术指纹

引用此