TY - GEN
T1 - A Dimension-Reduced FEM for Low-Frequency Electric Field Analysis of Ultra-Thin Metallic Interconnects
AU - Zhang, Han
AU - Zhang, Dongrong
AU - Ren, Qiang
N1 - Publisher Copyright:
© 2026 IEEE.
PY - 2026
Y1 - 2026
N2 - A dimension-reduced finite element method (FEM) is proposed for low-frequency electric field analysis of ultra-thin metallic interconnect structures. Conventional three-dimensional modeling of vias and routing lines requires extremely fine meshes along the thickness direction, leading to excessive computational cost. To overcome this limitation, the thin volumetric conductors are represented using a thickness-collapsed surface formulation through element mapping to a reference triangular element, with modified basis functions. As a result, the mesh density and degrees of freedom are significantly reduced while maintaining accuracy. Representative numerical results are presented to validate the effectiveness of the proposed approach.
AB - A dimension-reduced finite element method (FEM) is proposed for low-frequency electric field analysis of ultra-thin metallic interconnect structures. Conventional three-dimensional modeling of vias and routing lines requires extremely fine meshes along the thickness direction, leading to excessive computational cost. To overcome this limitation, the thin volumetric conductors are represented using a thickness-collapsed surface formulation through element mapping to a reference triangular element, with modified basis functions. As a result, the mesh density and degrees of freedom are significantly reduced while maintaining accuracy. Representative numerical results are presented to validate the effectiveness of the proposed approach.
KW - Finite element method
KW - dimension reduction
KW - interconnects
KW - isoparametric mapping
UR - https://www.scopus.com/pages/publications/105047540884
U2 - 10.1109/NEMO66765.2026.11622076
DO - 10.1109/NEMO66765.2026.11622076
M3 - 会议稿件
AN - SCOPUS:105047540884
T3 - IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, NEMO 2026 - Proceedings
BT - IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, NEMO 2026 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2026 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, NEMO 2026
Y2 - 1 July 2026 through 3 July 2026
ER -