TY - GEN
T1 - A Comprehensive Inductance-Aware Modeling Approach to Power Distribution Network in Heterogeneous 3D Integrated Circuits
AU - Wang, Quansen
AU - Pavlidis, Vasilis F.
AU - Cheng, Yuanqing
N1 - Publisher Copyright:
© 2025 EDAA.
PY - 2025
Y1 - 2025
N2 - Heterogeneous 3D integration technology is a cost-effective and high-performance alternative to planar integrated circuits (ICs). In this paper, we propose an on-chip power distribution network (PDN) modeling technique for heterogeneous 3D-ICs (H3D-ICs), which explicitly takes the effects of on-chip inductance into account. The proposed model facilitates efficient transient and AC simulations with integrated inductive effects, enabling accurate noise characterization at high frequencies and facilitating the exploration of early-stage PDN design. The model is validated via HSPICE simulations, demonstrating a maximum error below 1% and achieving average speedups of 1.5x in transient and 8.5x in AC simulations.
AB - Heterogeneous 3D integration technology is a cost-effective and high-performance alternative to planar integrated circuits (ICs). In this paper, we propose an on-chip power distribution network (PDN) modeling technique for heterogeneous 3D-ICs (H3D-ICs), which explicitly takes the effects of on-chip inductance into account. The proposed model facilitates efficient transient and AC simulations with integrated inductive effects, enabling accurate noise characterization at high frequencies and facilitating the exploration of early-stage PDN design. The model is validated via HSPICE simulations, demonstrating a maximum error below 1% and achieving average speedups of 1.5x in transient and 8.5x in AC simulations.
KW - 3D heterogeneous integration
KW - modeling and analysis
KW - power distribution network
UR - https://www.scopus.com/pages/publications/105006937033
U2 - 10.23919/DATE64628.2025.10992810
DO - 10.23919/DATE64628.2025.10992810
M3 - 会议稿件
AN - SCOPUS:105006937033
T3 - Proceedings -Design, Automation and Test in Europe, DATE
BT - 2025 Design, Automation and Test in Europe Conference, DATE 2025 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2025 Design, Automation and Test in Europe Conference, DATE 2025
Y2 - 31 March 2025 through 2 April 2025
ER -