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A Combined Powder Metallurgical Approach to Process Gamma-TiAl with Composite Structure

  • Beihang University
  • University of Leicester

科研成果: 期刊稿件文章同行评审

摘要

Gamma-TiAl (> 99 pct) sample with composite structural design was fabricated by a combined powder metallurgical approach of the SEBM capsule and HIP. Selective electron beam melting (SEBM) was used to create the pre-sintered powder bed, composite structure and the capsule, followed by hot isostatic pressing (HIP) at 1250 °C. A mixture of plasma rotating electrode (PREP) and gas atomization (AA) processed powders, with the respective higher (49.66 at. pct) and lower Al (47.61 at. pct) concentrations, was employed successfully to track the transition from powder to bulk sample, providing enriched information to elucidate the microstructure formation mechanism. The selective melting created composite structure consisted of the fine equiaxed γ-grains, while the rest of the powder bed that had been subjected to preheat only and then HIP was characterized by the triple microstructure. Formation mechanisms of such unique microstructure, consisting of primarily the coarse γ-grains and fine γ-grains with the previous particle boundaries (PPBs), were correlated to the Al concentration. The Al-rich powder was transformed into the coarse γ-grains, while the Al-depleted powder was responsible for the fine γ-grains with the PPBs. This finding suggests that the detrimental PPBs can be eliminated by increasing the Al concentration in the nascent powder. In the post-heat treated condition (1350 °C), no PPBs was found, suggesting that heat treatment is beneficial by eliminating the PPBs. For the designed composite structures, there was evidence to suggest desired distribution of the hard and soft regions, with the fine γ-grains associated with the composite structure being responsible for the high hardness region.[Figure not available: see fulltext.].

源语言英语
页(从-至)2351-2368
页数18
期刊Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
53
7
DOI
出版状态已出版 - 7月 2022

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