TY - GEN
T1 - A case study of the delamination analysis of plastic encapsulated microcircuits based on scanning acoustic microscope inspection
AU - Liang, Yu
AU - Zhang, Sujuan
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/12/16
Y1 - 2014/12/16
N2 - Delamination is a common defect of the Plastic encapsulated microcircuits (PEMs). So, delamination analysis is an important item in Screening, DPA and failure analysis of PEMs. This paper studies the delamination of a buffer in thin shrink small outline package (TSSOP) by using a scanning acoustic microscope (SAM). By using scanning modes of A-scan, B-scan, C-scan and X-scan of the SAM and analysis the result of the scanning, this paper obtained the delamination information of the buffer in detail. At last, this paper summarized a general method of delamination analysis, and the comparison between the method and the traditional method used in Screening, DPA and failure analysis of PEMs is provided.
AB - Delamination is a common defect of the Plastic encapsulated microcircuits (PEMs). So, delamination analysis is an important item in Screening, DPA and failure analysis of PEMs. This paper studies the delamination of a buffer in thin shrink small outline package (TSSOP) by using a scanning acoustic microscope (SAM). By using scanning modes of A-scan, B-scan, C-scan and X-scan of the SAM and analysis the result of the scanning, this paper obtained the delamination information of the buffer in detail. At last, this paper summarized a general method of delamination analysis, and the comparison between the method and the traditional method used in Screening, DPA and failure analysis of PEMs is provided.
KW - Delamination
KW - PEMS
KW - SAM
KW - TSSOP
UR - https://www.scopus.com/pages/publications/84943160112
U2 - 10.1109/PHM.2014.6988161
DO - 10.1109/PHM.2014.6988161
M3 - 会议稿件
AN - SCOPUS:84943160112
T3 - Proceedings of 2014 Prognostics and System Health Management Conference, PHM 2014
SP - 190
EP - 193
BT - Proceedings of 2014 Prognostics and System Health Management Conference, PHM 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 Prognostics and System Health Management Conference, PHM 2014
Y2 - 24 August 2014 through 27 August 2014
ER -