高导热金刚石/铜复合材料研究进展

Significance: With the continuous advancement of electronic devices toward miniaturization, integration, and high-power density, the significant increase in power density has made efficient thermal management essential for ensuring stable device operation. Due to its exceptional thermal conductivity, diamond can be combined with high-conductivity metals such as copper to form advanced thermal management materials with high thermal conductivity and low thermal expansion coefficients. However, the pronounced acoustic mismatch and poor interfacial compatibility between the two phases severely hinder the transmission of heat carriers across the interface, resulting in an actual thermal conductivity of diamond/copper composites that falls far below theoretical predictions. This limitation has significantly restricted their engineering applications and has consequently drawn extensive attention to the structural design of interfaces and the underlying heat transport mechanisms in diamond/copper composites. Although considerable progress has been made in improving the thermal conductivity of diamond/copper composites, current research still lacks a systematic summary of theoretical models, interfacial engineering approaches, and influencing factors. Therefore, a comprehensive review focusing on predictive modeling, interface optimization strategies, and microstructural design is urgently needed to provide theoretical guidance and technical reference for the practical application of diamond/copper composites. Progress: In the context of thermal conductivity prediction for composite systems, the Hasselman-Johnson (H-J) model, the acoustic mismatch model (AMM), the diffuse mismatch model (DMM), and the differential effective medium (DEM) model have provided theoretical descriptions of heat transfer behavior from the perspectives of interfacial thermal resistance, reinforcement phase distribution, and particle-particle interactions. These models contribute to understanding the formation mechanisms of interfacial thermal resistance but are predominantly based on idealized interface assumptions, which limits their applicability to complex, real-world structures. For interfacial engineering, Cu matrix alloying and diamond surface metallization have become two widely adopted modification strategies. The former improves interfacial wettability and facilitates the formation of stable interfacial phases by introducing carbide-forming metal elements. The latter typically involves deposition of metal coatings via techniques such as magnetron sputtering, followed by heat treatment to in situ generate a continuous carbide interlayer at the interface, thereby enhancing interfacial thermal transport. In terms of structural optimization, parameters such as alloying element content, crystallographic orientation of diamond, and the selection and thickness control of interlayer materials significantly affect the thermal conductivity of the composites. Synergistic regulation of these structural parameters promotes interfacial bonding and facilitates the construction of efficient heat conduction pathways. Conclusions and Prospects: In summary, although existing theoretical models contribute to the understanding of thermal conduction mechanisms in composites, their reliance on idealized assumptions limits their ability to accurately predict the thermal conductivity of diamond/copper composites. Cu matrix alloying and diamond surface metallization significantly enhance interfacial bonding and heat carrier transport efficiency, thereby markedly improving the thermal conductivity of the composites. Furthermore, analysis of influencing factors indicates that the synergistic regulation of alloying content, crystallographic orientation, and interlayer structure is key to achieving high thermal conductivity in composites. To realize the optimal thermal conductivity and engineering applicability of diamond/copper composites, this work proposes the following strategies regarding theoretical modeling, modification approaches, and performance-related parameters: (1) developing more reliable models to accurately predict thermal conductivity; (2) optimizing interlayer composition to improve interfacial compatibility and overall heat conduction; (3) precisely controlling the thickness and distribution of the interlayer to ensure optimal thermal performance. Based on the above, the ideal microstructure of diamond/copper composites should reflect multidimensional synergy among compositional matching, interfacial configuration, and processing techniques. Such a design should involve: regulating diamond orientation and content to achieve ordered reinforcement distribution and continuous heat conduction pathways; introducing acoustically matched and thickness-controllable interlayer materials to establish efficient low-resistance thermal transport routes; and optimizing interfacial structure and processing parameters to simultaneously strengthen bonding and enhance heat transfer performance.