近紫外LED封装器件的热稳定性及可靠性

With many advantages, ultraviolet light-emitting diode(UV LED) packages have been widely applied in many beyond-lighting areas, including healthcare, disinfect, environmental protection and sensing. By using both simulations and experiments, this paper investigates the thermal stabilities and high temperature ageing reliability of near UV LED devices with three different packaging structures. The results indicate that, the radiation power and forward voltage of all samples show a downward trend with the increase of substrate temperature, but the downward trend of UV LED with flip-chip packaging structure is significantly less than that of wire bonding UV LEDs; the reliability test under the 55℃ and constant rated current condition shows that the luminous flux, radiation power and color coordinate of flip-chip type UV LEDs are relatively stable than those of wire-bonding type UV LEDs. Generally, this study can conclude that the flip-chip packaging structure with lower thermal resistance, small size and long life can improve the optical and thermal stabilities and reliability of UV LEDs.