航空电子限时令牌太赫兹互连的实时性能分析

Using Terahertz communication technology to achieve centimeter level inter-board/chip interconnection in avionics can reduce pins and connectors, electronic equipment volume, and maintenance costs. For the short-range Terahertz communication network with omni-directional antenna transceiver and on-off keying (OOK) modulation, the calculation results of Terahertz channel capacity are given by analyzing the point-to-point communication link considering the molecular absorption noise and loss. Combined with the timed token multi-access protocol between nodes, and according to the channel capacity, the service curve model is used to analyze the total flow analysis (TFA) and separate flow analysis (SFA) in the worst case. The real-time performance analysis method of time limited token Terahertz interconnection is obtained by fully considering the burst degree of application layer communication task with probability guarantee. The case study shows that, compared with time division multiple access (TDMA), the collision free multiple access mechanism based on time limited token protocol can adapt to the random changes of physical layer capacity and application layer load, ensure less delay, and is conducive to the realization of Terahertz Interconnection Networking and real-time communication between avionics chips and boards.